2016
DOI: 10.1002/aelm.201600326
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Comprehensive Writing Margin Analysis and its Application to Stacked one Diode‐One Memory Device for High‐Density Crossbar Resistance Switching Random Access Memory

Abstract: The sneak current through the neighboring cells interrupts reading of a selected cell in high-resistance state in crossbar resistance switching random access memory (RRAM). As the sneak current mainly originates from a parallel resistance component to a selected cell, write operation, which requires suffi ciently high voltage delivered to the selected cell, has been regarded to have little relevance to the sneak current issue. In this work, it is revealed that an additional voltage drop on the wire resistances… Show more

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Cited by 40 publications
(41 citation statements)
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“…[22] Furthermore, it was proven that three other asymmetric devices are capable of performing the RFSM logic, revealing the universality of the proposed logic concept. The proposed RFSM logic concept has a framework similar to that of the CRS logic: the terminal voltages are used to denote the logic inputs, and the logic output is represented by the resistance state, implying a strict LIM feature.…”
Section: Introductionmentioning
confidence: 89%
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“…[22] Furthermore, it was proven that three other asymmetric devices are capable of performing the RFSM logic, revealing the universality of the proposed logic concept. The proposed RFSM logic concept has a framework similar to that of the CRS logic: the terminal voltages are used to denote the logic inputs, and the logic output is represented by the resistance state, implying a strict LIM feature.…”
Section: Introductionmentioning
confidence: 89%
“…The stacked structure is functionally equivalent to a diode stacked over a URS memory, as shown by the schematic figure at the bottom-right inset of Figure 3a. [22,27] The upper electrode of the diode layer is defined as a top electrode (TE), which corresponds to terminal T 1 described in the logic concept, whereas the electrode under the URS layer is a bottom electrode (BE) corresponding to terminal T 2 . [25] The URS memristor (Pt/TiO 2 /Pt) is located below the diode.…”
Section: Experimental Demonstration Of the Rfsm Logic Using A 1d-1r Dmentioning
confidence: 99%
“…[3,9,62] In fact, it seems that a low interconnection wire resistance is already a critical issue in 3D XPoint, as can be identified from the unusually high W wire in the disclosed device structure. As discussed in the previous section, in V-NAND, the WL and BL are placed along the lateral and vertical directions, making the necessary number of critical patterning steps for WL and BL only one per line, no matter how many layers were stacked, which makes V-NAND very cost-competitive.…”
Section: D-integrated Pcram-3d Xpointmentioning
confidence: 99%
“…[9,[88][89][90][91][92][93][94][95] Among these, the simple rotation of the planar CBA by 90° cannot be considered a feasible solution because it involves almost identical technical difficulties in making the multilayer stacked planar CBA, including the issue of the increasing number of interconnection wires. As this type of integration scheme was suggested very recently, there is insufficient literature available on it at this time, but there have been several related suggestions and demonstrations.…”
Section: Vertically Integrated Resistance-based Memory With a Cell Sementioning
confidence: 99%
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