Computational light junction temperature estimator for active thermal control

Andresen, Markus; Schloh, Mike; Buticchi, Giampaolo; Liserre, Marco

doi:10.1109/ecce.2016.7854953

Cited by 34 publications

(13 citation statements)

References 13 publications

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“…The most significant techniques in this field are based on the evaluation of switching times or on the threshold voltage of the body diode [4] and [5]. Other techniques rely on a thermal-electrical model of the component [6]. Most of the TSEP techniques require complex calibration, and this makes their application to commercial converters impractical.…”

Section: Introductionmentioning

confidence: 99%

Online Junction Temperature Estimation of SiC Power <sc>mosfets</sc> Through On-State Voltage Mapping

Stella

Pellegrino

Armando

et al. 2018

IEEE Trans. on Ind. Applicat.

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Section: Introductionmentioning

confidence: 99%

Online Junction Temperature Estimation of SiC Power <sc>mosfets</sc> Through On-State Voltage Mapping

Stella

Pellegrino

Armando

et al. 2018

IEEE Trans. on Ind. Applicat.

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“…Measuring parameters such as the collector emitter voltage of IGBTs or the ON state resistance of MOSFETs enables to identify the wear-out of the power semiconductors [10]. However, for effectively applying active thermal control, the knowledge of the junction temperature is required and can be accessed by measurement with thermosensitive electrical parameters, observers, or estimators [25].…”

Section: B Motivation For Power Routingmentioning

confidence: 99%

Power Routing for Cascaded H-Bridge Converters

Andresen

Buticchi

2017

IEEE Trans. Power Electron.

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Abstract-Modular power converters are expected to play a major role in medium-and high-voltage/power applications. Normally, each module processes the same amount of power; however, this does not take into consideration that different modules can have a different remaining useful lifetime. This paper proposes the concept of power routing for cascaded H-bridge (CHB) converters, with the purpose of delaying the failure of the system. A third-harmonic injection into the duty cycles allows extending the imbalance capability of the structure, keeping the CHB operational even if some power paths are completely unloaded. Analytic investigation in conjunction with simulation and experimental measurements demonstrate the power routing by means of the proposed method.

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“…A cheaper solution can be realized by model based approaches only requiring low bandwidth case temperature measurement and the thermal characteristics provided in the datasheet [36]. The computation effort can be reduced by transforming the fourth order Foster model to second order [36]. A disadvantage of the model based approaches are model uncertainties and often the neglected thermal coupling between different power semiconductors.…”

Section: A Thermal Principles and Lifetime Expectationmentioning

confidence: 99%

“…Particularly, in modular power converters, there is the additional challenge of a high number of power semiconductors, resulting in many junction temperatures to be taken into account. A cheaper solution can be realized by model based approaches only requiring low bandwidth case temperature measurement and the thermal characteristics provided in the datasheet [36]. The computation effort can be reduced by transforming the fourth order Foster model to second order [36].…”

Section: A Thermal Principles and Lifetime Expectationmentioning

confidence: 99%

Thermal Analysis and Balancing for Modular Multilevel Converters in HVDC Applications

Hahn

Andresen

Buticchi

et al. 2018

IEEE Trans. Power Electron.

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Abstract-The modular multilevel converter (MMC) has become a very attractive solution for interfacing high voltages in hybrid networks. The MMC enables scalability to different power levels, full controllability provided by IGBTs and can achieve very high efficiencies by using a low switching frequency method as the nearest level modulation. However, the nearest level modulation requires a capacitor voltage balancing algorithm, which can result in unbalanced loading for the power semiconductors in the different submodules. Particularly at low power factor operation, which could occur in case of low-voltage ride through and of reactive power injection, the conventional algorithm is not effective anymore. This article provides thermal stress analysis of the MMC in operation and proposes a thermal balancing approach, which is embedded in the capacitor voltage balancing algorithm. The purpose of the thermal balancing is to achieve similar stress distribution among the different submodules to enhance the lifetime. The junction temperatures in the different submodules are studied for HVDC applications and the article proves experimentally, that the thermal balance within the submodules is significantly improved.

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Computational light junction temperature estimator for active thermal control

Cited by 34 publications

References 13 publications

Online Junction Temperature Estimation of SiC Power <sc>mosfets</sc> Through On-State Voltage Mapping

Online Junction Temperature Estimation of SiC Power <sc>mosfets</sc> Through On-State Voltage Mapping

Power Routing for Cascaded H-Bridge Converters

Thermal Analysis and Balancing for Modular Multilevel Converters in HVDC Applications

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