Computational study of the demolding process in nanoimprint lithography

Takai, Rina; Yasuda, Masaaki; Tochino, Takamitsu; Kawata, Hiroaki; Hirai, Yoshihiko

doi:10.1116/1.4897138

Cited by 14 publications

(13 citation statements)

References 20 publications

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“…The inner force-time curves indicate the inner behaviors during the separation process that is used in the previous reports to analyze the interfacial joining properties [ 36 , 37 ]. Figure 11 shows the interaction energies of polymer-metal hybrid structure and inner forces in PP layer during the separation process with different substrates.…”

Section: Resultsmentioning

confidence: 99%

Atomistic Investigation on the Wetting Behavior and Interfacial Joining of Polymer-Metal Interface

Zhou

Jiang

et al. 2020

Polymers

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Polymer-metal hybrid structures can reduce the weight of components while ensuring the structural strength, which in turn save cost and subsequently fuel consumption. The interface strength of polymer-metal hybrid structure is mainly determined by the synergistic effects of interfacial interaction and mechanical interlocking. In this study, the wetting behavior of polypropylene (PP) melt on metal surface was studied by molecular dynamics simulation. Atomistic models with smooth surface and nano-column arrays on Al substrate were constructed. Influences of melt temperature, surface roughness and metal material on the wetting behavior and interfacial joining were analyzed. Afterwards the separation process of injection-molded PP-metal hybrid structure was simulated to analyze joining strength. Results show that the initially sphere-like PP model gradually collapses in the wetting simulation. With a higher temperature, it is easier for molecule chains to spread along the surface. For substrate with rough surface, high density is observed at the bottom or on the upper surface of the column. The contact state is transitioning from Wenzel state to Cassie–Baxter state with the decrease of void fraction. The inner force of injection-molded PP-Fe hybrid structure during the separation process is obviously higher, demonstrating a greater joining strength.

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Section: Resultsmentioning

confidence: 99%

Atomistic Investigation on the Wetting Behavior and Interfacial Joining of Polymer-Metal Interface

Zhou

Jiang

et al. 2020

Polymers

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“…In the stochastic simulations of the UV-curing process, the motion of the UV-cured polymers cannot be traced. Therefore, we performed MD simulations developed for thermal nanoimprint lithography (T-NIL) to analyze the de-molding process [7][8][9]. Because the force field for the UV-cured resist is not known, we investigated the de-molding process of the poly(methyl methacrylate) (PMMA) resist.…”

Section: Simulation Modelmentioning

confidence: 99%

Computational Study of Pattern Formationin UV Nanoimprint Lithography

Yasuda

Koyama

Sakata

et al. 2018

J. Photopol. Sci. Technol.

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We have investigated the pattern formation process in ultraviolet (UV) nanoimprint lithography by stochastic and molecular dynamics (MD) simulations. The UV-curing process was investigated by stochastic simulations. The simulations show the polymerization process of UV-cured molecules. The effect of the photoinitiator concentration of the UV-cured resist was also investigated by stochastic simulations. The sizes and shapes of the reacted monomers in UV-cured resists with various molecular weights were also shown. The de-molding process was investigated by MD simulations. For a resist with a relatively low molecular weight, fracture and stretching of the pattern are observed during the de-molding process.

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“…The simulation works about thermal nanmimprint have been shown by researchers [5,6]. Fan et al have introduced a multi-scale approach for investigation of interfacial delamination , which links nanoscale and macroscale [7].…”

Section: Introductionmentioning

confidence: 99%

A multi-scale simulation method to predict delamination and adhesion force in UV-nanoimprint lithography

Zhong

Kwok

Yuen

2016

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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Nanoimprint lithography (NIL) provides a low cost process for nano-pattern mass production. Polymer filling and de-molding processes determine the quality of the imprinted pattern in NIL. In UV-nanoimprint lithography, low viscous polymer reduces the requirement of imprint pressure in polymer filling. The interaction between prepatterned mold and UV-curable polymer during demolding greatly affect the patterning result. Due to the length scale issues, molecular simulation or traditional finite element method cannot individually simulate the de-molding process. Therefore, a multi-scale approach combining both MD simulation and finite element analysis is proposed to predict the adhesion force between the mold and polymer layer in UV-nanoimprint lithography.The present study is focused on incorporating material behavior at the de-molding interface of nano-patterns. Simulation of molecular dynamics is used to calculate the interfacial energy between the polyvinyl alcohol mold and a methacrylate-based resist layer. A stress-displacement curve can be achieved from the slope of the energydisplacement relation. The result is then utilized to characterize the material properties of cohesive zone elements at the finite element model. A contact debonding model is built to simulate the de-molding process. And the model is verified by the results from peel-off experiment.

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Computational study of the demolding process in nanoimprint lithography

Cited by 14 publications

References 20 publications

Atomistic Investigation on the Wetting Behavior and Interfacial Joining of Polymer-Metal Interface

Atomistic Investigation on the Wetting Behavior and Interfacial Joining of Polymer-Metal Interface

Computational Study of Pattern Formationin UV Nanoimprint Lithography

A multi-scale simulation method to predict delamination and adhesion force in UV-nanoimprint lithography

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