The plane strain fracture toughness (K Ic) and conventional tensile properties of two commercially produced one-inch thick Ti-5A1-2.5Sn plates were determined at cryogenic temperatures. One plate was extra-low interstitial (ELI) grade, the other normal interstitial. Portions of each plate were mill annealed at 1088 0K (1500 0F) followed by either air-cooling or furnace-cooling. The tensile properties, flow curves, and K Ic of these plates were determined at 295 0 K (room temperature), 77 0K (liquid nitro?en temperature), and 200K (liquid hydrogen temperature). The air-cooled ELI plate was the toughest material evaluated. K Ic of the furnace-cooled ELI plate was about 25 percent below that of the air-cooled ELI material. Cooling rate from the annealing temperature had no influence on 1 the toughness of the normal interstitial plates, both of which had a K Ic approximately half that of the air-cooled ELI plate. The 20 0K fracture toughness of the normal interstitial plates varied only slightly with specimen orientation. The LS toughness of both ELI plates was approximately 20 percent greater. than the LT toughness. Based on these results and a study of the microstructural fracture mechanism, it is recommended that Ti-5A1-2.5Sn which is to be used in applications requiring high fracture toughness have the lowest possible interstitial level and be aircooled from the annealing treatment so as to prevent ordering.