Thin
metal films (Au, Ir, Cr, and Sc), deposited by an electron
beam on bulk, exfoliated WS2 and WTe2 using
two different reactor base pressures (high vacuum (HV) <2 ×
10–6 mbar; ultrahigh vacuum (UHV) <2 × 10–9 mbar), are explored to study the effects of reactor
ambient on the interface chemistry formed at room temperature between
bulk metal contacts and tungsten dichalcogenides (TDCs). Au forms
a van der Waals interface with WS2 and a covalent interface
with WTe2, independent of reactor ambient. In contrast,
an intermetallic is detected at the Ir–WS2 and Ir–WTe2 interfaces regardless of the reactor ambient. The low work
function metals Cr and Sc, which are more reactive than their high
work function counterparts (Au and Ir), completely reduce the TDC
layer(s) in direct contact. Sc is completely oxidized in situ when
deposited in an elastomer-sealed deposition tool (in HV). These results
highlight that the interface between metals and TDCs is most often
covalent, which contrasts the common misconception that a van der
Waals gap is present. Furthermore, the band alignment between the
four metals investigated here and bulk WS2 deviates significantly
from that predicted by the Schottky–Mott rule. These results
elucidate the true chemistry of select metal–TDC interfaces
and highlight the rapid oxidation that manifests in situ in a HV metallization environment. Our work emphasizes the need
to consider the true interface chemistry when engineering and modeling
metal contacts to WS2 and WTe2.