2019
DOI: 10.1016/j.carbon.2019.07.057
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Conductance interference effects in an electron-beam-resist-free chemical vapor deposition graphene device sandwiched between two h-BN sheets

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Cited by 8 publications
(6 citation statements)
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“…Commercial high crystalline quality and large-area SL/multilayer (ML) h-BN was grown on copper (Cu) foils by chemical vapor deposition (CVD) methods to perform only for wet transfer methods [37][38][39][40]. The homogeneous and high-purity h-BN crystals were fabricated by the high-pressure techniques [41], and we used the scotch tape method to mechanically exfoliate the finite-area (below 50 μm ´50 μm) h-BN flakes with 10-50 nm thickness as only for dry transfer methods [42]. High-quality and wafer-scale SL mediator-assisted CVD MoS 2 or WS 2 on commercial p-type doping Si substrate capped with 285-300 nm SiO 2 wafer by thermal oxidation methods [43] were successfully grown by 40 nm MoO 3 /WO 3 deposited on graphite paper and 100 SCCM of H 2 S gas as precursors.…”
Section: Methodsmentioning
confidence: 99%
“…Commercial high crystalline quality and large-area SL/multilayer (ML) h-BN was grown on copper (Cu) foils by chemical vapor deposition (CVD) methods to perform only for wet transfer methods [37][38][39][40]. The homogeneous and high-purity h-BN crystals were fabricated by the high-pressure techniques [41], and we used the scotch tape method to mechanically exfoliate the finite-area (below 50 μm ´50 μm) h-BN flakes with 10-50 nm thickness as only for dry transfer methods [42]. High-quality and wafer-scale SL mediator-assisted CVD MoS 2 or WS 2 on commercial p-type doping Si substrate capped with 285-300 nm SiO 2 wafer by thermal oxidation methods [43] were successfully grown by 40 nm MoO 3 /WO 3 deposited on graphite paper and 100 SCCM of H 2 S gas as precursors.…”
Section: Methodsmentioning
confidence: 99%
“…In order to fabricate high-quality single-layer SnSe 2 /CVD graphene/h-BN quantum devices, we adopted the scotch tape method to mechanically exfoliate 20 ∼ 50 nm h-BN layers and placed them on a 300 nm-thick SiO 2 wafer as the based plane so as to improve single-layer SnSe 2 /CVD graphene mobility. Furthermore, we used poly(bisphenol A carbonate) (PC) to transfer single-layer SnSe 2 /CVD graphene to the h-BN based plane by our two-dimensional material transferring manipulator [24,[29][30][31] and put the sample to chloroform in 10 min to remove PC so as to maintain the ideal cleanness as the side view of schematic diagram in figure 2(a) [32]. Six Cr/Au contacts (of 5 and 80 nm thickness) were patterned using e-beam lithography and lift-off processing and annealed at 500 • C with Ar/H 2 (9:1) mixing gases for 1 h so as to clean the PC and PMMA residues on the single-layer SnSe 2 /CVD graphene/h-BN device as shown in figure 2…”
Section: Methodsmentioning
confidence: 99%
“…Based on the concept of structure and working principle of the device, the bottom graphene layer can assist in the growth of single-layer SnSe 2 and produce high-quality 2D interface [23]. Moreover, the bottom hexagonal boron nitride (h-BN) flake could enhance coherent transport in disordered 2D systems [24]. Such a hybrid single-layer SnSe 2 /graphene structure shows a record-breaking thermoelectric figure of merit ZT = 2.34 [23].…”
Section: Introductionmentioning
confidence: 99%
“…Figure 11D–F show that the synthesized few‐layer BN nanosheets consisted of 3–5 layers stacked with a pore diameter of about 20 nm. Considering that most of the boron‐containing precursors are highly toxic, MBE, 85 CVD, 86 and metal–organic chemical vapor deposition 82b are good choices in addition to the traditional nanosheet preparation methods for large‐scale applications. The synthesis conditions are relatively less stringent, the coverage area is only affected by the substrate, and a large number of continuous h‐BNs can be prepared more efficiently; insulating/inert substrates and transition metal substrates are generally used.…”
Section: Typical 2d Semiconductor Nanosheetsmentioning
confidence: 99%