2017
DOI: 10.1515/polyeng-2016-0273
|View full text |Cite
|
Sign up to set email alerts
|

Conductive mechanism of carbon black/polyimide composite films

Abstract: AbstractDuring the fabrication of black polyimide composite films, it is common to introduce carbon black (CB) into this composite system. The introduction of CB significantly decreases the resistivity of the films and consequently has a great effect on the inherent insulation property of polyimide. Here, the exploration of the conductive mechanism of CB/polyimide composite films is aimed to explain the change on resistivity fundamentally. In this study, two kinds of representa… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
23
0

Year Published

2018
2018
2024
2024

Publication Types

Select...
8

Relationship

2
6

Authors

Journals

citations
Cited by 34 publications
(23 citation statements)
references
References 28 publications
0
23
0
Order By: Relevance
“…The 3D interlayer conduction contributes to enhancing the electronic properties [52]. On the other hand, the spacing between particles is reduced, making the hopping of electrons in the conductive filler easier and increasing the probability that electrons tunnel between nanofillers [53,54]. Flexibility is the basic requirement for flexible devices; therefore, a cyclic bending test (video demo in Fig.…”
Section: Similar Results Have Been Mentioned In Previous Reportsmentioning
confidence: 99%
“…The 3D interlayer conduction contributes to enhancing the electronic properties [52]. On the other hand, the spacing between particles is reduced, making the hopping of electrons in the conductive filler easier and increasing the probability that electrons tunnel between nanofillers [53,54]. Flexibility is the basic requirement for flexible devices; therefore, a cyclic bending test (video demo in Fig.…”
Section: Similar Results Have Been Mentioned In Previous Reportsmentioning
confidence: 99%
“…Again, as in the case of black high-temperature resistant labels, black and electrical conductive additives are often introduced into the PI matrix so as to eliminate the effects of electrostatic charges on the printing process. However, in most of the microelectronic applications, the sacrifice of the Up to now, most of the black PI films have been developed by composite methodology, which is the combination of standard PI films with black additives, either with the inorganic ones, such as carbon black [21,22], carbon nanotube [23], and graphene [24], or with the organic black dyes. As we know, the inorganic black dyes or pigments are usually electrically conductive; thus, the derived black PI composite films usually exhibit reduced electrical resistivities.…”
Section: Introductionmentioning
confidence: 99%
“…Polyimide (PI) has been well-known as a high-performance material that shows wide application in aerospace, electronics, petrochemical, precision machinery and other fields. Its unique structure endows PI with excellent thermal stability, low water-absorption, outstanding mechanical behavior and low dielectric constant (1)(2)(3)(4)(5). One of the important applications of PI film is to be used in manufacturing flexible printed circuit boards (FPCBs).…”
Section: Introductionmentioning
confidence: 99%