Phase evolution and microstructure development in silver-clad Bi-2223 composite conductors have been investigated as a function of filament count (mono, 19, 85 and 361), precursor powder type (metallic powder or oxide powder), oxygen partial pressure (<10-3 to 0.13 atm), temperature (790-855 °C) and time (0-6000 min). Favourable conditions for rapid Bi-2223 phase formation and stability were achieved with an oxygen partial pressure around 0.08 atm, regardless of precursor type or filament count. In general, the rate of the Bi-2223 formation reaction increased and the width of the temperature window for rapid kinetics became broader as the filament count increased. The most rapid kinetics and the broadest heat treatment window were observed for the 361-filament metallic powder composite. These trends in Bi-2223 formation rate and stability are believed to be associated with the increased proximity of powder to silver as the filament count increases and the filament transverse dimensions become smaller. For each conductor type (in terms of precursor form and filament type) there was an optimum processing temperature in ca 0.08 atm O2 that produced a well-developed Bi-2223 grain colony microstructure with the least amount of second-phase. This optimum temperature was near the peak of the reaction rate versus temperature profile.