Abstract:Off-stoichiometry thiol-ene-epoxy (OSTE+) thermosets have recently gained attention for the rapid prototyping of microfluidic chips because they show low permeability to gases and little absorption of dissolved molecules, they allow direct low-temperature dry bonding without surface treatments, they have a low Young's modulus, and they can be manufactured via UV polymerisation. The compatibility with standard clean-room processes and the outstanding mechanical properties make OSTE+ an excellent candidate as a … Show more
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