“…However, the application of PCMs is limited due to their poor thermal conductivity, severe super-cooling problems, and risk of leakage when the storage medium undergoes phase change [48][49][50]. As a consequence, various techniques have been considered to improve the thermal functionality of PCMs including: i) fins [49,[51][52][53][54][55][56], ii) filling materials (metal foams) [57][58][59][60][61], iii) micro and nano-encapsulation of the PCM [49,50,62], and iv) adding nanoparticles (NPs) to the PCM (nanoPCM) [49,[63][64][65][66][67][68]. Several types of nanomaterial have been considered such as carbons (e.g.…”