2023
DOI: 10.1149/11102.0027ecst
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Consideration of Improved Adhesion of Direct Copper Seed Layer by Medium-Vacuum Sputtering Using Vacuum Ultraviolet Light

Abstract: A sputtering method is used to form the seed layer for copper electric plating. In general, copper sputtering has weak adhesion to resin, so titanium sputter is combined to increase the adhesion strength. However, etching in the lithography process requires two types of processes, titanium and copper metal. Adhesion strength was improved by performing vacuum ultraviolet (VUV) treatment as a pretreatment for medium-vacuum sputtering. We discovered the relationship between the hydroxyl groups on the resin surfac… Show more

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