2020 IEEE 70th Electronic Components and Technology Conference (ECTC) 2020
DOI: 10.1109/ectc32862.2020.00129
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Considerations on a Smart Strategy for Simultaneously Testing Multiple PCB Assemblies in Board Level Vibration

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Cited by 3 publications
(6 citation statements)
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“…It includes board designs that can contain 4 components and 1 component on the PCB to allow homogenous stress transfer to all stressed components on the board. 1 component test board design enables understanding of stress applied to the solder interconnects [36]. Investigations with 12, 7, and 5 component board layouts can also found in [37][38][39] respectively.…”
Section: Test Board Designsmentioning
confidence: 99%
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“…It includes board designs that can contain 4 components and 1 component on the PCB to allow homogenous stress transfer to all stressed components on the board. 1 component test board design enables understanding of stress applied to the solder interconnects [36]. Investigations with 12, 7, and 5 component board layouts can also found in [37][38][39] respectively.…”
Section: Test Board Designsmentioning
confidence: 99%
“…Otherwise, boards might have different mechanical properties that induce distinctive stresses onto the component. This part is studied by Thukral et al [36] and limited strain variation from PCB to PCB is reported.…”
Section: Test Board Designsmentioning
confidence: 99%
See 3 more Smart Citations