Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples

Herkommer, D.; Punch, Jeff; Reid, M.

doi:10.1109/tcpmt.2012.2227481

Cited by 20 publications

(5 citation statements)

References 16 publications

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“…This might be due to the reversion and recrystallization of solder alloys resulting from rapid deformation during loading process. Herkommer also found similar behavior of SAC305 Solder with wave patterns appeared when strain rate increased to 0.01s -1 , which was more pronounced at a higher temperature [30]. In view of that, the strain rate and temperature have pronounced effect on the stress-strain behavior of solder alloys.…”

Section: A Experimental Resultssupporting

confidence: 52%

Constitutive behavior and Anand model of novel lead-free solder Sn-Zn-Bi-In-P

Liu

Zhang

et al. 2014

2014 International Conference on Electronics Packaging (ICEP)

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The Anand constitutive model has emerged as a popular method to describe the inelastic deformation behavior of Sn-Pb solders and, more recently, to describe the behavior of lead-free solders in electronic assemblies, mainly due to its effective description of constitutive behavior and high compatibility with finite element modes. Heretofore, although plenty of experimental and theoretical works have been conducted on building constitutive models for lead-free solders, e.g. Sn-Ag, Sn-Ag-Cu, Sn-Cu based solders, insufficient works have been conducted on modeling Sn-Zn based lead-free solder alloys.In this paper, a series of compression tests were conducted for a novel lead-free solder Sn-9Zn-2.5Bi-0.5In-0.05P and Sn-8Zn-3Bi solder at three constant strain rates (10 -3 /s, 10 -2 /s, 10 -1 /s) and different temperatures (20℃, 60℃, 100℃). Anand constitutive model was applied to describe the inelastic behavior as well as saturation stress of both solder alloys. Comparison of the experimental results and Anand model predictions were evaluated with the material parameters extracted from compression tests and non-linear least squares fitting of the constitutive relation. The results reveal that, for both two solder alloys, the Anand model predictions are in good agreement with experimental data of stress-strain responses at various strain rates and temperatures applied in the present work. In addition, the stress-strain responses of both solder alloys are also discussed on the basis of experimental data.

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Section: A Experimental Resultssupporting

confidence: 52%

Constitutive behavior and Anand model of novel lead-free solder Sn-Zn-Bi-In-P

Liu

Zhang

et al. 2014

2014 International Conference on Electronics Packaging (ICEP)

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“…Lots of scholars implemented the Anand model to simulate the stress-strain relationship of a variety of solders successfully. [4][5][6][7][8][9][10][11][12][13] However, Chen et al 3 found that the Anand model cannot accurately predict the response of material which has the specification of strong strain-hardening effect at low temperature. Thus, they proposed a modified Anand model by correlating h 0 with temperature and strain rate…”

Section: Models Without the Definition Of Yield Surfacementioning

confidence: 99%

A critical review of constitutive models for solders in electronic packaging

Chen

Zhao

2017

Advances in Mechanical Engineering

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Owing to their superior electrical, thermal, and mechanical properties, solder joints are the most widely used interconnection materials in electronic product packaging. Because the failure of the whole electronic packaging is often induced by the failure of solders, modeling and simulation of solder joint performance are quite important in ensuring the quality and reliability of electronic products. In fact, the accuracy of reliability design of electronic packaging is dependent on accelerated reliability tests, material constitutive models, finite element modeling, and fatigue-life prediction models. Here, the material constitutive model plays the most important role in the development of electronic reliability design because the stress, strain, and strain energy density adopted in finite element modeling and fatigue-life prediction are all computed and derived from the constitutive model. In this work, the constitutive models developed for simulating the complex stress and strain response of solders are critically reviewed. To make the description concise and comprehensive, the constitutive models were categorized into two types: the constitutive models with and without the definition of yield surface. The prediction capabilities, application scope, merits and shortcomings, and objective suggestions for the further development of constitutive models for solders in electronic packaging are proposed.

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“…(1-3) represent are shown in Table . [17]. The Anand model parameters of SAC305 are shown in Table . In this study the material properties for the DBC copper layers were adopted from Dong and Miller, as shown in Table [18,19].…”

Section: B Materials Propertiesmentioning

confidence: 99%

Effect of micro-channel on warpage and residual stress due to reflow process in IGBT modules

Zhang

et al. 2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

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With the trend to be smaller, more integration and higher power in power electronic technology, the cooling problem has become increasingly prominent for those high power devices. Micro-channel in substrate, as an effective cooling method, has been proposed and investigated by many researchers in recent years. Warpage and stress, naturally existing in all the packaging processes due to the unavoidable mismatch of coefficient of thermal expansion (CTE) between materials, can be problematic on reliability. Compared to the traditional substrate, the substrate integrated with micro-channel maybe result in the increase of the warpage and residual stress after packaging processes. In this paper a 1200V Insulated Gate Bipolar Transistor (IGBT) module as a prototype was investigated to describe effects of the microchannel on warpage and residual stress of the substrate due to reflow process. Finite element analysis method with viscoplastic solder model was used to study the reflow process. The Anand constitutive model, which has been adopted successfully to represent the viscoplastic behavior of solder materials, was used to model the material properties of SAC305 solder layers in this study. The whole reflow process was modeled by element "death and activation" technology, and the traditional substrate model and the model of the substrate integrated with microchannel were taken for comparison. The effect of the size and the arrangement of the micro-channel in substrate on warpage and residual stresses after reflow process were also studied.

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Constitutive Modeling of Joint-Scale SAC305 Solder Shear Samples

Cited by 20 publications

References 16 publications

Constitutive behavior and Anand model of novel lead-free solder Sn-Zn-Bi-In-P

Constitutive behavior and Anand model of novel lead-free solder Sn-Zn-Bi-In-P

A critical review of constitutive models for solders in electronic packaging

Effect of micro-channel on warpage and residual stress due to reflow process in IGBT modules

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