Constitutive Modeling of Sintered Nano-silver Particles: A Variable-order Fractional Model versus an Anand Model

Fan, Jiajie; Gu, Tijian; Wang, Ping; Cai, Wei; Fan, Xuejun; Zhang, Guoqi

doi:10.1109/eurosime52062.2021.9410807

Cited by 2 publications

(1 citation statement)

References 13 publications

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“…Many studies have been published on the mechanical properties of AgNPs [3 -5], for example, Fan et al [3] performed tensile tests of sintered AgNPs under different strain rates. They found the tensile strength of sintered AgNPs samples declines under the low st rain rate and higher temperature.…”

Section: Introductionmentioning

confidence: 99%

Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

Poelm³

et al. 2023

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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The application of microporous sintered copper (Cu) as a bonding material to replace conventional die-attach materials in power electronic devices has attracted considerable interest. Many previous studies have focused on the effect of processing parameters (temperature, time, pressure) on the microstructure evolution of sintered Cu. However, there are only a few studies with regard to the mechanical properties of sintered Cu. As the die-attach layer undergoes thermal and mechanical stress durin g its application, it is essential to investigate the micro-scale mechanical properties of sintered Cu. Fracture toughness is a measure of the resistance of a material to crack propagation under predominantly linear-elastic conditions, which is an essential para meter for predictin g fracture failure. As cracks and defects are difficult to avoid during fabrication and application processing for sintered Cu, which will defin itely cause a sign ificant effect on micromechanical properties. Thus, it is essential to reveal the effect of microstructure on fracture toughess of sintered Cu nanoparticles.

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Section: Introductionmentioning

confidence: 99%

Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

Poelm³

et al. 2023

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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On numerical solution of two-dimensional variable-order fractional diffusion equation arising in transport phenomena

Salama,

Fairag

2024

MATH

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<abstract><p>In recent years, the application of variable-order (VO) fractional differential equations for describing complex physical phenomena ranging from biology, hydrology, mechanics and viscoelasticity to fluid dynamics has become one of the most hot topics in the context of scientific modeling. An interesting aspect of VO operators is their capability to address the behavior of scientific and engineering systems with time and spatially varying properties. The VO fractional diffusion equation is a fundamental model that allows transitions among sub-diffusive, diffusive and super-diffusive behaviors without altering the underlying governing equations. In this paper, we considered the two-dimensional fractional diffusion equation with the Caputo time VO derivative, which is essential for describing anomalous diffusion in real-world complex systems. A new Crank-Nicolson (C-N) difference scheme and an efficient explicit decoupled group (EDG) method were proposed to solve the problem under consideration. The proposed EDG method is based on a skewed difference scheme in conjunction with a grouping procedure of the solution grid points. Special attention was devoted to investigating the stability and convergence of the proposed methods. Three numerical examples with known exact analytical solutions were provided to illustrate our considerations. The proposed methods were shown to be stable and convergent theoretically as well as numerically. In addition, a comparative study was done between the EDG method and the C-N difference scheme. It was found that the proposed methods are accurate in simulating the considered problem, while the EDG method is superior to the C-N difference method in terms of Central Processing Unit (CPU) timing, verifying the efficiency of the former method in solving the VO problem.</p></abstract>

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Constitutive Modeling of Sintered Nano-silver Particles: A Variable-order Fractional Model versus an Anand Model

Cited by 2 publications

References 13 publications

Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

On numerical solution of two-dimensional variable-order fractional diffusion equation arising in transport phenomena

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