2014
DOI: 10.1016/j.applthermaleng.2013.10.042
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Constructal design and thermal analysis of microchannel heat sinks with multistage bifurcations in single-phase liquid flow

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Cited by 150 publications
(49 citation statements)
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“…A few studies have focused on reducing chip temperature nonuniformity (DT s,max ) under a uniform chip heat flux map. These include use of flow boiling of dielectric liquid [16], single phase liquid cooling with variable pin fin density [17], variable microchannel width in the streamwise direction [18][19][20] and double-layer microchannel structure [21].…”
Section: Introductionmentioning
confidence: 99%
“…A few studies have focused on reducing chip temperature nonuniformity (DT s,max ) under a uniform chip heat flux map. These include use of flow boiling of dielectric liquid [16], single phase liquid cooling with variable pin fin density [17], variable microchannel width in the streamwise direction [18][19][20] and double-layer microchannel structure [21].…”
Section: Introductionmentioning
confidence: 99%
“…However, more bifurcations cause higher pressure drop and higher required pumping power. Therefore, there is an optimal number bifurcation for improving the overall thermal performance, including the pumping power, of the heat sink [6]. One technique to reduce the pressure drop in the microchannels is to use transversal-wavy design.…”
Section: Introductionmentioning
confidence: 99%
“…The optimization of GTB's cooling problem was also studied by using constructal theory [10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25]. Bejan and Lorente (Ref.…”
Section: Introductionmentioning
confidence: 99%