Constructal Optimization of Rectangular Microchannel Heat Sink with Porous Medium for Entropy Generation Minimization

Li, Wenlong; Xie, Zhihui; Xi, Kun; Xia, Shaojun; Ge, Yanlin

doi:10.3390/e23111528

Cited by 15 publications

(6 citation statements)

References 67 publications

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“…All the subfigures used different legends scales due to the significant difference in the obtained results. The figure shows the typical wall temperature distribution contours, which match the literature [33,35,36]. The contours show that the metal inserts considerably reduced the average wall temperature and nonuniformity.…”

Section: Resultssupporting

confidence: 68%

A Micro-Metal Inserts Based Microchannel Heat Sink for Thermal Management of Densely Packed Semiconductor Systems

et al. 2022

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The thermal management of high-heat-density devices is essential for reliable operation. In this work, a novel procedure is proposed and investigated for the efficient thermal management of such devices. The proposed procedure introduces different arrangements of metal inserts within a cooling channel heat sink. The objective of those inserts is to form boundary layers to prevent any hot spots from appearing within the flow and increase temperature uniformity. Five different arrangements are introduced and numerically investigated using the commercial software package ANSYS FLUENT 2021R1. The model was validated against previous findings and showed a good agreement with errors of less than 5.5%. The model was then used to study the heat transfer characteristics of the proposed cases compared to traditional straight channels under the same operating conditions. All the proposed arrangements displayed better heat transfer characteristics than the traditional configuration within the studied range. They also exhibited lower temperature nonuniformities, implying better temperature distribution. The temperature contours over the heat source top surface and the flow streamlines are also introduced. Among all the proposed arrangements cases, a microchannel with micro metal insert located at the top wall along with a second row of inserts covering two-thirds of the bottom wall is studied. This case achieved the best heat transfer characteristics and highest temperature uniformity, making it a viable candidate for high power density devices’ thermal management.

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Section: Resultssupporting

confidence: 68%

A Micro-Metal Inserts Based Microchannel Heat Sink for Thermal Management of Densely Packed Semiconductor Systems

et al. 2022

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“…The heat transfer properties of microchannels with serrated fins were examined by Zhang J [13], and the results of the experiment revealed that the fin structure may improve heat transfer by raising the pressure drop and converting laminar flow into turbulence. Wenlong L [14] established a porous medium rectangular microchannel heat sink (MCHS) model. According to the construction theory, the aspect ratio and HS aspect ratio of the heat sink (HS) unit are optimized by using the entropy generation minimization (EGM) numerical simulation method.…”

Section: Introductionmentioning

confidence: 99%

Numerical simulation of heat transfer performance of double-layer flat microchannels with different channel shapes

Yang,

Feng,

Shella

et al. 2023

Preprint

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Currently, the flow channel shape of double-layer flat microchannel heat sinks is mostly rectangular. It is still unknown, though, how different channel forms affect how well microchannels dissipate heat. This study used numerical simulation software COMSOL to simulate the double-layer flat microchannel heat dissipation structures of rectangular (MC-DLRC), staggered rectangular (MC-DLCFRC), circular (MC-DLCC), semi-circular (MC-DLHRC), and trapezoidal (MC-DLTC) and obtained the optimal microchannel flow structure. The results show that the overall performance of trapezoidal double-layer flat microchannels (MC-DLTC) has been significantly improved compared to rectangular double-layer flat microchannels (MC-DLCC). PEC is increased by 17.68-29.45%. Research was conducted on the bottom angle of trapezoidal microchannels, and the differences between vertical and staggered arrangement of microchannels were also studied.

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“…The liquid cooling heat sink has become a widely favored chip-heat dissipation solution owing to its small size [5], strong heat dissipation capacity, and easy packaging. To further improve the heat dissipation capacity of the liquid cooling heat sink, several scholars have conducted research on the optimal design of the liquid cooling heat sink [6][7][8][9][10][11][12][13][14][15]. Among them, the embedded heat sink cooling technology shortens the heat dissipation path of the chip from "chip-TIM-packing-shell-TIM-heat sink" to "chip-heat sink-working fluid", that is, it bypasses the chip packaging and directly cools the hotspot of the chip [16], effectively coping with the more severe heat dissipation challenge caused by the surge during chip integration.…”

Section: Introductionmentioning

confidence: 99%

Suitability of Embedded Liquid Cooling and Heat Generation for Chips

Zhang,

Wu,

Xie

et al. 2023

Micromachines

Self Cite

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Embedded liquid cooling is a preferred solution for dissipating the heat generated by high-power chips. The cooling capacity and pump power consumption of embedded liquid cooling heat sinks differ significantly between different structures. To achieve an accurate match between cooling capacity and heat dissipation requirements, the selection of a liquid-cooled heat sink should be carefully considered in conjunction with the heat dissipation needs of heat sources in real-world thermal management issues. Based on the manufacturing limitations on chip temperature and microchannel pressure, a composite performance index function was developed to assess the cooling capacity and cooling cost of the heat sink. This allowed for the establishment of an evaluation standard to determine the suitability of embedded liquid cooling and heat sink for the heat source. In this study, the suitability of four microchannel heat sinks with the same feature length and fin volume was evaluated under various thermal load conditions. The results show that the best-suited heat sink changes with variations in the thermal load of the chip. In the example, when the heat source was homogeneous at 100 W, the circular section pin fins have an optimal suitability of 0.928 for Re = 500. When the heat source was a heterogeneous heat source with a power of 100 W, the value of Θ was found to be 0.389. Additionally, the optimal suitability of drop section pin fins for Re = 971.5 was determined to be 0.862.

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Constructal Optimization of Rectangular Microchannel Heat Sink with Porous Medium for Entropy Generation Minimization

Cited by 15 publications

References 67 publications

A Micro-Metal Inserts Based Microchannel Heat Sink for Thermal Management of Densely Packed Semiconductor Systems

A Micro-Metal Inserts Based Microchannel Heat Sink for Thermal Management of Densely Packed Semiconductor Systems

Numerical simulation of heat transfer performance of double-layer flat microchannels with different channel shapes

Suitability of Embedded Liquid Cooling and Heat Generation for Chips

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