Constructing “sesame‐biscuit” structured hybrids with SiC and Ag particles for enhancing thermal conductivity and dielectric constant of elastomer composites
Abstract:With the development of multifunctional and miniaturized integrated circuits, polymeric materials with large dielectric constant and high thermal conductivity have major significance in modern electronic industry. In this work, “sesame‐biscuit” structured thermally conductive hybrids were prepared by polydopamine (PDA) modification and in‐situ electroless silver (Ag) plating on the surface of silicon carbide (SiC), referred as SiC‐P‐Ag. Then, the SiC‐P‐Ag was incorporated into epoxidized natural rubber (ENR) m… Show more
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