“…In particular, for the stable and safe operation of the devices, an efficient heat management system is necessary to dissipate the heat accumulated [4,5]. Toward this end, various studies have developed thermal interface materials consisting of a polymer matrix (epoxy [6], polyvinyl alcohol [7], and polyimide (PI) [8]) and highly thermally conductive fillers (graphite [9], graphene [10], carbon nanotubes [11], alumina [12], aluminum nitride [13], boron nitride [14], copper [15], and silver [16]). Phase change materials (PCMs) such as stearic acid [17], paraffin [18], and erythritol (ET) [19] have attracted attention as novel thermal management and energy storage systems, because of their high latent heat that facilitates heat conser-vation during the inflow and outflow of thermal energy.…”