2021
DOI: 10.1016/j.coco.2021.100704
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Constructing zebra skin structured graphene/copper composites with ultrahigh thermal conductivity

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Cited by 18 publications
(2 citation statements)
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“…Heat-dissipating materials with excellent thermal conductivity are a requirement for electronic packaging and thermal management. Liu et al [123] produced zebra-skin-like composites consisting of graphene paper and copper, exhibiting ultra-high thermal conductivity of 968 W/m K. Besides, the thermal-related properties of the devices can be tailored through adopting silica photonic crystal as visibly transparent thermal blackbody [124], or retaining the emission in the Vis-NIR range while suppressing the longer wavelengths by limiting the electron thermal fluctuation at specific region and enhancing the resonance behavior of the intrinsic semiconductor [125], using UV nanoimprint lithography method [126], achieving to efficient radiative-cooling performance.…”
Section: Othermentioning
confidence: 99%
“…Heat-dissipating materials with excellent thermal conductivity are a requirement for electronic packaging and thermal management. Liu et al [123] produced zebra-skin-like composites consisting of graphene paper and copper, exhibiting ultra-high thermal conductivity of 968 W/m K. Besides, the thermal-related properties of the devices can be tailored through adopting silica photonic crystal as visibly transparent thermal blackbody [124], or retaining the emission in the Vis-NIR range while suppressing the longer wavelengths by limiting the electron thermal fluctuation at specific region and enhancing the resonance behavior of the intrinsic semiconductor [125], using UV nanoimprint lithography method [126], achieving to efficient radiative-cooling performance.…”
Section: Othermentioning
confidence: 99%
“…In particular, for the stable and safe operation of the devices, an efficient heat management system is necessary to dissipate the heat accumulated [4,5]. Toward this end, various studies have developed thermal interface materials consisting of a polymer matrix (epoxy [6], polyvinyl alcohol [7], and polyimide (PI) [8]) and highly thermally conductive fillers (graphite [9], graphene [10], carbon nanotubes [11], alumina [12], aluminum nitride [13], boron nitride [14], copper [15], and silver [16]). Phase change materials (PCMs) such as stearic acid [17], paraffin [18], and erythritol (ET) [19] have attracted attention as novel thermal management and energy storage systems, because of their high latent heat that facilitates heat conser-vation during the inflow and outflow of thermal energy.…”
Section: Introductionmentioning
confidence: 99%