Construction of 3D boron nitride nanosheets/silver networks in epoxy-based composites with high thermal conductivity via in-situ sintering of silver nanoparticles

Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review

“…Second, the scales are limited to 11 W/mK and 90 wt.% BN; in this way, it is possible to show more clearly the region in which most of the experimental data lie and to identify the effects of the parameters, namely the surface treatment and the particle size. In some instances, the effect of surface treatment is so small as to be virtually negligible [71,74,82,123,131,148,155]. On the other hand, when the thermal conductivity is low (close to the lower trend line in Figure 9), a small absolute increase can translate into a significant percentage increase.…”

“…However, there are some functional groups, such as hydroxyls and amino groups, which are present on the narrow edge planes of these platelets, and these edges do offer the possibility of bonding in order to improve the matrix-particle contact. It is, therefore, quite common to aminate [71] or hydroxylate these edges, for example by sol-gel treatment with a strong alkali. These functionalised BN particles may be used directly in the epoxy-BN composite [69,71,85,124], or may additionally be treated with a coupling agent to further enhance the matrix-filler interface.…”

“…It is, therefore, quite common to aminate [71] or hydroxylate these edges, for example by sol-gel treatment with a strong alkali. These functionalised BN particles may be used directly in the epoxy-BN composite [69,71,85,124], or may additionally be treated with a coupling agent to further enhance the matrix-filler interface. Teng et al [57] used a zirconate coupling agent, but by far the most common are the silanes, of which numerous variants have been used, including (3-mercaptopropyl) trimethoxysilane, [97], (3-aminopropyl) triethoxysilane, APTES [88,109,138,155], epoxy-terminated dimethyl siloxane, ETDMS [101], and (3-glycidyloxypropyl) trimethoxysilane, GPTMS [66,138].…”

“…One of the important parameters with respect to the use of these epoxy-BN composites in insulated metal substrates is the simplicity of the fabrication process, as mentioned in the Introduction, but many of the results discussed above make use of a solvent in the dispersion of the functionalised BN particles in the epoxy resin system, which is generally an undesired industrial practice. The solvents most widely used are acetone [57,74,85,113,131,141,148] and ethanol [68,82,97,155], but others include methyl ethyl ketone and dimethyl formamide [96], and tetrahydrofuran [71]. On the other hand, "dry" or "direct" mixing, which obviates the use of any solvents in this composite fabrication step, was adopted by many researchers [54,88,109,113,123,137,138,144,149,156].…”

3D Interconnected Boron Nitride Networks in Epoxy Composites via Coalescence Behavior of SAC305 Solder Alloy as a Bridging Material for Enhanced Thermal Conductivity

“…Teng’s group reported the synthesis of a 3D boron nitride nanosheets (BNNS) network using the ice-templating method and connected these fillers with silver nanowire (AgNW) as “thermally conductive bridges” [ 10 ]. Xie’s group reported the construction of a 3D BNNS network with the coalescence behavior of AgNPs attached to the BNNS surface via the sintering process [ 11 ]. Wang’s group also constructed 3D filler networks of Al 2 O 3 for high thermal and mechanical properties [ 12 ].…”