Construction of bi-continuous structure in fPC/ABS-hBN(GB) composites with simultaneous enhanced thermal conductivity and mechanical properties

Li, Chenglin; Zhang, Hao; Zhang, Xiaowen; Zhang, Zechao; Li, Nan; Liu, Ying; Zheng, Xiu Ting; Gao, Dali; Wu, Dezhen; Sun, Jingyao

doi:10.1016/j.compscitech.2022.109437

Cited by 33 publications

(11 citation statements)

References 31 publications

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“…The thermal conductivity instrument (DRL-III, Xiangtan Xiangyi Instrument Co., Ltd, China) was used to measure the thermal conductivity (TC) and thermal conductivity enhancement per 1 vol% filler (TCEF) of samples. Samples with a diameter of 30 mm and a thickness of 2 mm were pressed under 300 N for 300 s. TCEF was calculated by Equation (1).…”

Section: Characterizationmentioning

confidence: 99%

“…With the emergence of the 5G era, there is a growing trend towards miniaturization, integration, and multifunctionality in electronic devices. 1,2 However, this increase in power density also leads to the accumulation of significant heat energy, posing unprecedented challenges to the safety, performance, and service life of electronic devices. 3 Consequently, there is a pressing need to enhance thermal management technology for electronic equipment.…”

Section: Introductionmentioning

confidence: 99%

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Enhanced thermal conductivity in boron nitride incorporated polyethylene/polymethyl methacrylate composites via double percolation structure

You,

Ke,

Tang

et al. 2024

Polymer Composites

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Due to the miniaturization, integration and multi‐functional development of contemporary electronic devices, there is a growing need for efficient thermal conductive composite materials. This study focuses on enhancing the dispersion of modified boron nitride (mBN) within a linear low‐density polyethylene (LLDPE) phase by incorporating LLDPE‐graft‐Aminomethylpyridine (LLDPE‐g‐Py) to non‐covalently modify BN. Additionally, polymethyl methacrylate (PMMA) and LLDPE polymers were introduced to create modified BN/LLDPE/PMMA (mBN/LLDPE/PMMA) composites with a double percolation structure. The co‐continuous structure of the polymer composites was observed by using scanning electron microscopy (SEM). By selectively locating the BN modified by LLDPE‐g‐Py within the LLDPE phase, the co‐continuous structure of the LLDPE/PMMA blend was upgraded to a double percolation structure. This double percolation structure establishes a dense and optimal heat transfer network within the polymer matrix. The thermal conductivity of the mBN/LLDPE/PMMA composite with BN loading of 40 wt% was significantly increased to 1.12 Wm−1 K−1, which was 350% higher than that of pure LLDPE, 38% higher than that of the BN/LLDPE composite, and 17% higher than that of the BN/LLDPE/PMMA composite. This study offers valuable insights into non‐covalent modification techniques for BN and the design of double percolation structures in thermal conductive polymer composites.Highlights The double percolation structure was successfully constructed by simple melt blending method with LLDPE and PMMA as matrix and BN as thermal conductive filler. The double percolation structure can significantly promote the efficiency of heat transfer inside the thermal conductive composites. A novel non‐covalent modifier LLDPE‐g‐Py was prepared to modify the surface of BN, and the selective localization of modified BN (mBN) in the LLDPE phase was realized.

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Section: Characterizationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Enhanced thermal conductivity in boron nitride incorporated polyethylene/polymethyl methacrylate composites via double percolation structure

You,

Ke,

Tang

et al. 2024

Polymer Composites

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“…[18][19][20] However, the main problem faced by thermally conductive polymer composites is the difficulty of complete separation between matrix and fillers, and the recycling of matrix materials and filler skeleton after separation is also hard. 5,[21][22][23] Because most of the matrix materials are nondegradable polymers, they can survive in the environment for decades or even centuries after their functional life. [24][25][26] These nondegradable polymer particles will be widely distributed in animals, water, soil, and other natural resources, and even found in infants' bodies.…”

Section: Introductionmentioning

confidence: 99%

Recyclable thermally conductive poly(butylene adipate‐co‐terephthalate) composites prepared via forced infiltration

Han

et al. 2023

SusMat

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With the rapid development of electronic equipment and communication technology, the demand for polymer composites with high thermal conductivity and mechanical properties has increased significantly. However, its nondegradable polymer matrix will inevitably bring more and more serious environmental pollution. Therefore, it is urgent to develop biodegradable thermally conductive polymer composites. In this work, biodegradable poly(butylene adipate-coterephthalate) (PBAT) is used as the matrix material, and vacuum-assisted filtration technology is employed to prepare carbon nanotube (CNT) and cellulose nanocrystal (CNC) networks with high thermal conductivity. Then CNT-CNC/PBAT composites with high thermal conductivity and excellent mechanical properties are prepared by the ultrasonic-assisted forced infiltration method. Both experiment and simulation methods are used to systematically investigate the thermally conductive and dissipation performances of the CNT-CNC/PBAT composites. Above all, a simple alcoholysis reaction is applied to realize the separation of the PBAT matrix and functional fillers without destroying the conductive network skeleton, which makes it possible for the recycling of thermally conductive polymer composites. K E Y W O R D Sforced infiltration, poly(butylene adipate-co-terephthalate) matrix, recyclable thermal interface material Chenglin Li, Yi Han, and Qingyuan Du contribute equally.

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“…[15][16][17][18] High thermally conductive fillers such as Cu, graphene, aluminum oxide (Al 2 O 3 ), boron nitride (BN), and carbon nanotube (CNT) play very important roles in λ of polymer composites with low filler content. [14,[19][20][21][22][23][24][25][26][27] In addition, they can also reduce the temperature gap of a thermal interface between surfaces. However, for carbon-based fillers, the increase in filler content may cause short-circuiting of electronic equipment.…”

Section: Introductionmentioning

confidence: 99%

Enhancing Thermal Conductivity, Electrical Insulation, and Mechanical Strength of Polydimethylsiloxane Composites with Sandwich Structure

An,

Li,

Liu

et al. 2023

Adv Eng Mater

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In this article, boron nitride (BN)/carbon nanotube (CNT)/boron nitride (BN) (BCB) film of sandwich structure is prepared by vacuum‐assisted filtration. Compared with the thermal conductivity (λ) of BNs–cellulose nanocrystals (CNCs) (BC) film, the λ of sandwich structured BCB films with the same thickness (The preparation process consists of one layer of BC and one layer of CNTs–CNCs (CC) until the completion of three layers of filtration) has been significantly improved. Then, the polydimethylsiloxane (PDMS) matrix is infiltrated into the BCB films by the ultrasonic‐assisted forced infiltration method. Prepared BN/CNT/BN/PDMS (BCBP) composites with sandwich structure have excellent λ and mechanical performance. When the weight ratio of BNs to CNCs is 20:1, the λ of BCBP20:1 attains 5.253 W (m K)−1, compared with other thermally conductive composites with the same thickness (0.1 mm), it has an obvious increase. Besides, the dielectric properties and mechanical flexibility of BCBP are also systematically analyzed. This sandwich structure is prepared in such a method that the BCBP will not cause short circuits in electronic devices under high temperatures while having high λ.

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Construction of bi-continuous structure in fPC/ABS-hBN(GB) composites with simultaneous enhanced thermal conductivity and mechanical properties

Cited by 33 publications

References 31 publications

Enhanced thermal conductivity in boron nitride incorporated polyethylene/polymethyl methacrylate composites via double percolation structure

Enhanced thermal conductivity in boron nitride incorporated polyethylene/polymethyl methacrylate composites via double percolation structure

Recyclable thermally conductive poly(butylene adipate‐co‐terephthalate) composites prepared via forced infiltration

Enhancing Thermal Conductivity, Electrical Insulation, and Mechanical Strength of Polydimethylsiloxane Composites with Sandwich Structure

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