Contact-displacement PD deposition for electroless copper application

Abstract

Electroless (EL) Cu, a potential seed layer material for Cu interconnects used in nanoelectronics, is intimately dependent on the surface activation of catalytic Pd particles. A comprehensive understanding on the deposition mechanism of Pd particles is thus critically important. In this thesis, the contact-displacement method of depositing Pd onto TiN surface is investigated in depth using statistical methods to track the time evolution of distributions of particle size, range, and density. The three