Contact thermal post-treatment of oriented strandboard to improve dimensional stability: A preliminary study

Effect of Post-production Heat Treatment on Particleboard from Sugarcane Bagasse

“…At higher temperatures (230 °C), the xylose and mannose contents in wood decrease, and arabinose and galactose disappear 17 , whereas between 250 °C and 330 °C, total destruction of hemicelluloses usually occurs 18 . Some studies have reported the influence of thermal treatment on the conventional particleboard-type wood panels, such as flakeboard, waferboard, MDF, and OSB, which have been proved promising, because, usually, heat treatment in already-consolidated panels provides improved dimensional stability and resistance to xylophage attack 13,19,20,21,22,23,24 . However, heat treatment in panels can also promote reduction of their mechanical properties 14,19,25 .…”

Reducing the thickness swelling of wood based panels by applying a nanotechnology compound

“…The first group includes methods that involve treatments applied to furnish before panel hot-pressing, such as particle pre-steaming and chemical or thermal modification of particles Youngquist et al 1986;Wu 1999;Hill 2006;Paul et al 2006). The second group comprises methods applied in the consolidated panels, and thermal treatment is the most common one (Del Menezzi and Tomaselli 2006;Okino et al 2007). Last, the production technology methods involve those that are related to improving resin content, mat-forming type and application of water repellents (Halligan 1970;Wu 1999).…”

Effects of Post Heat-Treatment on Surface Characteristics and Adhesive Bonding Performance of Medium Density Fiberboard

“…From the literature, we knew that post-manufacture heat-treatment decreased swelling, enhanced resistance of the wood-based panels to moisture absorption, and enhanced durability and fungal resistance of materials [15][16][17][18]. It has also been observed that heat-treatment of solid wood at high temperatures causes changes in the surface characteristics and adhesive bonding performance of wood [8,9].…”