Digest of Papers Eleventh Annual 1993 IEEE VLSI Test Symposium
DOI: 10.1109/vtest.1993.313296
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Contactless characterization of microwave integrated circuits by device internal indirect electro-optic probing

Abstract: This paper deals with a contactless working test system for the internal test of monolytic microwave integrated circuits (MMIC) based on both: III-V-semiconductor and Si-suhtrate materiaL This electro-optic test system determines the electrical field above the test-point within the MMIC. Measurements demonstrate the capability of this test system for device internal function control and failure analysis.

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Cited by 7 publications
(1 citation statement)
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“…Other methods and sensing systems such as Scanning Probe Microscopy are available and have the requisite spatial resolution but are more complicated in implementation requiring special physical probes [8,9]. Yet more complicated approaches involve electro-optic sensors based on changes in birefringence as a function of applied electric field or modulated scattering are more suited to internal MMIC level testing [10,11].…”
Section: Figure 1 Nfsa Electrical Block Diagrammentioning
confidence: 99%
“…Other methods and sensing systems such as Scanning Probe Microscopy are available and have the requisite spatial resolution but are more complicated in implementation requiring special physical probes [8,9]. Yet more complicated approaches involve electro-optic sensors based on changes in birefringence as a function of applied electric field or modulated scattering are more suited to internal MMIC level testing [10,11].…”
Section: Figure 1 Nfsa Electrical Block Diagrammentioning
confidence: 99%