Contactless wafer-level TSV connectivity testing method using magnetic coupling

Kim, J. J.; Kim, Heegon; Kim, Sukjin; Cho, Changhyun; Jung, Daniel; Kim, Joungho; Pak, Jun So

doi:10.1109/edaps.2012.6469404

Cited by 7 publications

(2 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Since the reciprocal contains three unknowns ( , , and ), three one-port measurements should be performed using three different calibration vias. To extract two-port network parameters from the three one-port measurements, we adopt the following formulas [5]: (1) where , , are the known reflection coefficients at the three calibration vias and , , are the reflection coefficients at the calibration vias from indirect-contact measurements using the dielectric contactor. From (1) the only contactor portion.…”

Section: A Setup and Proceduresmentioning

confidence: 99%

See 1 more Smart Citation

Indirect Contact Probing Method for Characterizing Vertical Interconnections in Electronic Packaging

Jeong

Kim

Kang

et al. 2015

IEEE Microw. Wireless Compon. Lett.

View full text Add to dashboard Cite

This letter proposes a new indirect contact probing method to characterize vertical interconnections without contact damage. At the first step of the proposed technique, multiple oneport calibration measurements should be performed to characterize the contactor layer between the probe pads and the deviceunder-tests (DUTs). The characteristics of the actual vias as the DUTs are then extracted from indirect-contact measurements by de-embedding the contactor layer. In simulations and experiments at frequencies range from 2.5 to 18 GHz, we have verified via defects can be successfully identified from the indirect-contact measurements.

show abstract

Section: A Setup and Proceduresmentioning

confidence: 99%

“…1(a), recently preferred characterization methods are based on non-contact probing techniques [1]. Among the existing non-contact methods using various coupling mechanisms [2], the capacitive coupling method is a possible solution for simple and cost effective characterization.…”

mentioning

confidence: 99%