Contamination Particles and Plasma Etching Behavior of Atmospheric Plasma Sprayed Y2O3 and YF3 Coatings under NF3 Plasma

Song, Je Boem; Kim, Jin Tae; Oh, Seong‐Geun; Yun, Ju-Yong

doi:10.3390/coatings9020102

Cited by 26 publications

(16 citation statements)

References 35 publications

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“…Recently, YOF and YF 3 have also drawn attention as ceramic coating materials for parts owing to their ability to suppress chemical reactions with fluoridated gases such as CF 4 and NF 3 [8][9][10][11][12][13]. Nevertheless, there have been few reports about the behavior of contamination particles by plasma etching [14]. Atmospheric plasma spraying (APS) methods are commonly used to coat parts with ceramic coating materials such as Y 2 O 3 and YF 3 .…”

Section: Introductionmentioning

confidence: 99%

Contamination Particle Behavior of Aerosol Deposited Y2O3 and YF3 Coatings under NF3 Plasma

Song

Choi

et al. 2019

Coatings

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The internal coatings of chambers exposed to plasma over a long period of time are subject to chemical and physical damage. Contamination particles that are produced by plasma damage to coatings are a major contribution to poor process reliability. In this study, we investigated the behavior of contamination particles produced from plasma damage to Y2O3 and YF3 protective coatings, which were applied by an aerosol deposition method. The coating materials were located at the powered electrode, the grounded electrode, and the grounded wall, which were exposed to a NF3 plasma. The mass loss at the powered electrode, which was exposed to the NF3 plasma etching under an applied bias, showed that the YF3 etching rate was higher than that of Y2O3. Conversely, the mass of coating increased at the grounded electrode and the grounded wall, which were exposed to NF3 plasma etching under zero bias. The mass of the Y2O3 coating increased more than that of the YF3 coating. X-ray photoelectron spectroscopy analysis showed that the Y2O3 coating corroded to YOxFy in the NF3 plasma, and YF3 existed as YFx. Light scattering sensor analysis showed that the YF3 coating produced fewer contamination particles than did the Y2O3 coating.

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Section: Introductionmentioning

confidence: 99%

Contamination Particle Behavior of Aerosol Deposited Y2O3 and YF3 Coatings under NF3 Plasma

Song

Choi

et al. 2019

Coatings

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“…The small RMS difference in the latter sample might be attributed to the YOF-altered layer formed on the plasma-treated Y2O3 surface. The Y-F bonds formed by YOF in the film might reduce the reactivity of YOF with fluorine radicals during the etching process [24]. The effects of the as-deposited Y2O3 films and SF6 plasma-treated Y2O3 films before and after fluorocarbon plasma etching were determined by XPS.…”

Section: Resultsmentioning

confidence: 99%

Plasma Etching Behavior of SF6 Plasma Pre-Treatment Sputter-Deposited Yttrium Oxide Films

Wang

Liu

et al. 2020

Coatings

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Yttrium oxyfluoride (YOF) protective materials were fabricated on sputter-deposited yttrium oxide (Y2O3) by high-density (sulfur fluoride) SF6 plasma irradiation. The structures, compositions, and fluorocarbon-plasma etching behaviors of these films were systematically characterized by various techniques. After exposure to SF6 plasma, the Y2O3 film surface was fluorinated significantly to form a YOF film with an approximate average thickness of 30 nm. X-ray photoelectron spectroscopy revealed few changes in the elemental and chemical compositions of the surface layer after fluorination, confirming the chemical stability of the YOF/Y2O3 sample. Transmission electron microscopy confirmed a complete lattice pattern on the YOF/Y2O3 structure after fluorocarbon plasma exposure. These results indicate that the SF6 plasma-treated Y2O3 film is more erosion resistant than the commercial Y2O3 coating, and thus accumulates fewer contamination particles.

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“…At the same time, yttria is a rare earth compound, making it an expensive plasma shielding candidate. On the other hand, magnesium oxide is comparatively cheaper, making the composite of Y 2 O 3 -MgO relatively economical with better plasma resistance property than the individual oxides.To understand the erosion mechanism under CF 4 and NF 3 plasma, the erosion behavior of Y 2 O 3 , Al 2 O 3 and YF 3 have been reported 14,20,21 . An oxide surface exposed to fluorocarbon plasma was initially fluorinated and then removed by a physical process combined with thermal cycling in wafer processing equipment 21 .It is notable that the surface roughness controlled by microstructures such as the grain size and defects such as pores for both bulk parts and coating parts strongly affect the amount of etching 16,22-24 .…”

mentioning

confidence: 99%

“…To understand the erosion mechanism under CF 4 and NF 3 plasma, the erosion behavior of Y 2 O 3 , Al 2 O 3 and YF 3 have been reported 14,20,21 . An oxide surface exposed to fluorocarbon plasma was initially fluorinated and then removed by a physical process combined with thermal cycling in wafer processing equipment 21 .…”

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confidence: 99%

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Remarkable plasma-resistance performance by nanocrystalline Y2O3·MgO composite ceramics for semiconductor industry applications

Park

Kim

et al. 2021

Sci Rep

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Motivated by recent finding of crystallographic-orientation-dependent etching behavior of sintered ceramics, the plasma resistance of nanocrystalline Y2O3-MgO composite ceramics (YM) was evaluated for the first time. We report a remarkably high plasma etching resistance of nanostructure YM surpassing the plasma resistance of commercially used transparent Y2O3 and MgAl2O4 ceramics. The pore-free YM ceramic with grain sizes of several hundred nm was fabricated by hot press sintering, enabling theoretical maximum densification at low temperature. The insoluble two components effectively suppressed the grain growth by mutual pinning. The engineering implication of the developed YM nanocomposite imparts enhanced mechanical reliability, better cost effectiveness with excellent plasma resistance property over their counterparts in plasma using semiconductor applications.

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Contamination Particles and Plasma Etching Behavior of Atmospheric Plasma Sprayed Y2O3 and YF3 Coatings under NF3 Plasma

Cited by 26 publications

References 35 publications

Contamination Particle Behavior of Aerosol Deposited Y2O3 and YF3 Coatings under NF3 Plasma

Contamination Particle Behavior of Aerosol Deposited Y2O3 and YF3 Coatings under NF3 Plasma

Plasma Etching Behavior of SF6 Plasma Pre-Treatment Sputter-Deposited Yttrium Oxide Films

Remarkable plasma-resistance performance by nanocrystalline Y2O3·MgO composite ceramics for semiconductor industry applications

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