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SPONSOR/MONITOR'S REPORT NUMBER(S)12The top-down fabrication of an in-plane nanowire (NW) GaAs metal-oxide-semiconductor field-effect transistor (MOSFET) by focused-ion beam (FIB) etching and chemical oxidation is reported. The device has a semiconductor-on-insulator structure with an n+-GaAs/Al2O3 layer stack implemented by lateral hydrolyzation oxidation. A 2 micron-long channel having an effective cross section ~70 x 220 nm is directly fabricated into the n+-GaAs layer by FIB etching. The channel is electronically isolated from the substrate by the Al2O3 layer and is effectively an in-plane NW epitaxially connected to the source and drain for a planar MOSFET within a single layer. The NW channel is surrounded by an ~15 nm-thick gate oxide.
IntroductionNanowires are a potential structure for replacing planar CMOS in next generation electronics. Most investigations have relied on vertical growth (often with wire-to-wire variations in linewidths and random positioning) based on vapor-liquid-solid (VLS) catalyzed growth. Moving this technology from single transistor measurements to the construction of circuits with billions of transistors to complement existing integrated circuit technologies would require pick and place technologies to which are inherently slow and non-scalable. An attractive alternative that has received much less attention is the top-down fabrication of in-plane nanowires where the relative locations and interconnections are defined by lithographic processes. We are exploring the capabilities of III-V semiconductors in a SOI geometry which are well-developed technologies capability of scaling to dense circuit structures ...