Control of Adhesion Strength and TSV Filling Morphology of Electroless Barrier Layer

Abstract

In this study, we investigated to control adhesion property of the electroless plated barrier layer on SiO2 by addition of saccharin and its deposition profile in a high aspect ratio TSV with inhibitor and saccharin. We achieved high adhesion strength of barrier layer by addition of suitable amount saccharin. Furthermore, we succeeded in the formation of thin continuous electroless barrier layer for a high aspect ratio TSV with addition of both inhibitor and saccharin. The proposed highly adhesive and conformal electroless barrier layer formation would provide a highly reliable all-wet TSV filling process.