In order to make full use of the potential fatigue crack growth resistance provided by layered architectures, a validated crack path simulation algorithm for crack propagation through different elements of the layered architectures was established. The crack path approaching a material interface was predicted by using the maximum tangential strain (MTSN) criterion and the crack behavior at the interface was simulated by a developed two-step method (a modified stressand-energy-based cohesive zone method considering the change in direction of an interface penetrating crack). The crack path simulation by using this algorithm in layered example architectures indicates (1) there are two criteria zones for the transition between crack deflection and penetration in terms of the relationship between interfacial strength and toughness; (2) the likelihood of a crack deflecting out of the interface will increase with the propagation of an interfacial crack; and (3) the architecture difference which affects shielding or anti-shielding behavior has a significant effect on crack deflection or penetration events.cohesive elements, crack path, finite element analysis, layered architectures, MTSN criterion
| INTRODUCTIONLayered architectures can supply good fracture resistance due to the barriers provided to the evolution of flaws by the alternating hard and soft layers, thus being widely used in various engineering applications which experience complex service conditions. 1,2 For instance, different structures at different length scales are organized hierarchically to provide stiffness as well as fracture resistance in some biological systems. 1 Multi-layered components comprising three main functional layers are applied in some moving mechanical systems within the internal combustion engine, which provide the combined properties of high mechanical strength, conformability, good wear resistance, and fatigue performance. [3][4][5] Multilayer metal films are used to endure large stretching, compressing, or twisting deformations to resist the occurrence of cracking and buckling in stretchable electronics, especially paper-like electronic displays, wearable electronics, and prosthetic skin. [6][7][8] However, these varied advantages offered by layered architectures in the optimization of performance may be limited due to a lack of understanding of the failure mechanisms.A series of studies have been carried out on the mechanisms of fatigue of layered architectures, but most just focus on the effect of multiple layers on the crack growth behavior and note this extends the crack growth life in