Control of fracture at the interface of dissimilar materials using randomly oriented inclusions and networks

Birman, Victor

doi:10.1016/j.ijengsci.2018.05.011

Cited by 11 publications

(5 citation statements)

References 83 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Microstructures such as the biphasic microneedle array made of swellable polymers can also be applied to enhance the interfacial strength via “mechanical interlocking” with the adjacent material, yet the microstructures require a compatible microfabrication process . More often, the interfacial toughening has been achieved by embedding randomly distributed stiff inclusions such as fibers or spherical particles in the compliant material, in which stress trapping was used to alleviate the fracture propagation . Some nanomaterials have also been embedded in the polymer or other engineering material as a composite matrix for reinforcing the interfacial bonding with a secondary material.…”

Section: Introductionmentioning

confidence: 99%

“…8 More often, the interfacial toughening has been achieved by embedding randomly distributed stiff inclusions such as fibers or spherical particles in the compliant material, in which stress trapping was used to alleviate the fracture propagation. 9 Some nanomaterials have also been embedded in the polymer or other engineering material as a composite matrix 10 for reinforcing the interfacial bonding with a secondary material. For instance, the interfacial bonding of poly(methyl methacrylate) can be reinforced by few layers of functionalized graphene.…”

Section: ■ Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Adhesion Strengthening Mechanism of Carbon Nanotube-Embedded Epoxy Composites: A Fracture-Based Approach

Huang

Meng

et al. 2022

ACS Appl. Mater. Interfaces

View full text Add to dashboard Cite

Interfacial bonding integrity between different materials is critical to maintain the functionality of the entire physical system in any scale, ranging from building structures down to semiconductor transistors. For example, micro-patterned polymers embedded with conductive nanoparticles [e.g., carbon nanotubes (CNTs)] bonded with integrated circuits have been applied as many emerging chemical/biological microelectronic sensors. Nonetheless, it is challenging to measure and ensure the interfacial bonding integrity between materials for consistent and sustainable operations. Herein, we apply multiple interface characterization methods based on micro-engineering and microscopy as an integrative approach to reveal the mechanism of interfacial reinforcement by adding CNTs in a matrix material. An epoxy/CNT micro-beam is fabricated onto a silicon substrate, sandwiching a gold layer as an interfacial precrack. Superlayers of chromium are then repeatedly deposited onto the microstructure, inducing stepwise increasing stress over the materials and the corresponding micro-beam bending after detachment from the bonded interface. Accordingly, we can quantify key interfacial fracture parameters such as crack length, steady-state energy release rate, and fracture toughness. By further examining the formation and distribution of the micro-/nanostructures along the debonded interface using bright-field microscopy, 3D fluorescence imaging, and scanning electron microscopy, we can identify the underlying dominant interfacial strengthening and fracture toughening mechanisms. We further compare experimental results and theoretical predictions to quantify the interfacial bonding properties between epoxy/CNT and silicon and unveil the underlying reinforcement mechanisms. The results provide insights to develop polymer/nanoparticle composites with reinforced interfacial bonding integrity for more sustainable and reliable applications including microelectronics, surface coatings, and adhesive materials.

show abstract

Section: Introductionmentioning

confidence: 99%

Section: ■ Introductionmentioning

confidence: 99%

Adhesion Strengthening Mechanism of Carbon Nanotube-Embedded Epoxy Composites: A Fracture-Based Approach

Huang

Meng

et al. 2022

ACS Appl. Mater. Interfaces

View full text Add to dashboard Cite

show abstract

“…For the study of interfacial crack-defect interaction in bimaterials see the work of Huang, Guo and Yu (2018) and Piccolroaz, Mishuris and Movchan (2010). A method for controlling the fracture at the interface of a dissimilar medium has been proposed by Birman (2018) through the use of randomly distributed inclusions. Beom and Jang (2012) have derived the solution for problem of a bimaterial containing an interfacial wedge crack subjected to Mode III loading.…”

Section: Introductionmentioning

confidence: 99%

Dynamic phenomena and crack propagation in dissimilar elastic lattices

Gorbushin

Mishuris

Movchan

2020

International Journal of Engineering Science

View full text Add to dashboard Cite

Dynamic Mode III interfacial fracture in a dissimilar square-cell lattice, composed of two contrasting mass-spring lattice half-planes joined at an interface, is considered. The fracture, driven by a remotely applied load, is assumed to propagate at a constant speed along the interface. The choice of the load allows the solution of the problem to be matched with the crack tip field for a Mode III interfacial crack propagating between two dissimilar continuous elastic materials. The lattice problem is reduced to a system of functional equations of the Wiener-Hopf type through the Fourier transform. The derived solution of the system fully characterises the process. We demonstrate the existence of trapped vibration modes that propagate ahead of the crack along the interface during the failure process. In addition, we show as the crack propagates several preferential directions for wave radiation can emerge in the structured medium that are determined by the lattice dissimilarity. The energy attributed to the wave radiation as a result of the fracture process is studied and admissible fracture regimes supported by the structure are identified. The results are illustrated by numerical examples that demonstrate the influence of the dissimilarity of the lattice on the existence of the steady failure modes and the lattice dynamics.

show abstract

“…It is very challenging to assemble two kinds of materials that have different atomic arrangements and different thermal stabilities. This produces a number of mechanical problems such as surface reconstruction [5,[18][19][20], different thermal stabilities and material strain due to the lattice mismatch [21]. Moreover, the assembly of different 2D materials and the precise control of the interfacial properties are key to obtaining high quality vdW heterostructures.…”

Section: Introductionmentioning

confidence: 99%

Mechanical peeling of van der Waals heterostructures: Theory and simulations

Lin

Zhao

2019

Extreme Mechanics Letters

View full text Add to dashboard Cite

Mechanical peeling is crucial for the assembly process of van der Waals (vdW) heterostructures. We provide a new theory to describe the peeling of vdW heterostructures based on interatomic potential. Representatively, we present the peeling of graphene on molybdenum disulfide (MoS 2) using a bottomup approach. The results show that there are three stages (the initial, stable and jump out of contact stages) in the entire peeling process. We find that the traditional continuum model is only suitable for the stable stage, while our theory can describe the entire process from (the initial unstable) contact to the end of the stable stage. In addition, we discovered a new characteristic length, the elasto-peeling length L ep = √ 2D/∆γ = 4σ 0 √ 2π D/H, that is a crucial parameter that reflects the bending (D) and interfacial properties (∆γ) of the layered materials during peeling. Finally, the theory as expressed by the Hamaker constant (H) is presented. Our findings may help to reveal the underlying mechanisms in the peeling of layered materials at the atomic scale.

show abstract

Control of fracture at the interface of dissimilar materials using randomly oriented inclusions and networks

Cited by 11 publications

References 83 publications

Adhesion Strengthening Mechanism of Carbon Nanotube-Embedded Epoxy Composites: A Fracture-Based Approach

Adhesion Strengthening Mechanism of Carbon Nanotube-Embedded Epoxy Composites: A Fracture-Based Approach

Dynamic phenomena and crack propagation in dissimilar elastic lattices

Mechanical peeling of van der Waals heterostructures: Theory and simulations

Contact Info

Product

Resources

About