2023
DOI: 10.1016/j.pmatsci.2023.101153
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Control of grain structure, phases, and defects in additive manufacturing of high-performance metallic components

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Cited by 79 publications
(13 citation statements)
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“…The solidification microstructure of the LPBF-fabricated metallic materials depends highly on the undercooling ∆T ahead of solid/liquid (S/L) interface [46,79]. For pure metals, solidification occurs with a stable planar interface.…”
Section: Effect Of Solution Treatment On Microstructuresmentioning
confidence: 99%
“…The solidification microstructure of the LPBF-fabricated metallic materials depends highly on the undercooling ∆T ahead of solid/liquid (S/L) interface [46,79]. For pure metals, solidification occurs with a stable planar interface.…”
Section: Effect Of Solution Treatment On Microstructuresmentioning
confidence: 99%
“…In this case, the rapid solidification process of liquid-solid phase transformation during LPBF occurs at extremely high cooling rates, typically exceeding 10 6 K s −1 [19]. Consequently, non-equilibrium solidification microstructures are formed under significantly large subcooling and high grain growth rates, resulting in increased solute solid solubility, much smaller grain size compared with conventionally processed counterparts, and reduced element segregation [20]. For instance, Wang et al [21] observed that the grain size of LPBF-printed pure Zn was approximately 10 µm compared to hundreds of microns for casted Zn.…”
Section: Introductionmentioning
confidence: 99%
“…• Common steels and alloys of nickel, titanium, aluminium, and copper are not designed to withstand rapid cooling, repeated thermal cycles, large temperature gradients, and fluctuating stresses during AM. Therefore, they often do not provide optimum microstructures and properties and suffer from defects [5]. New alloys, especially tailored for AM, are being developed primarily based on thermodynamic and kinetic approaches.…”
Section: Introductionmentioning
confidence: 99%
“…External fields such as ultrasounds, magnetic fields, electric fields, and auxiliary heating are applied to improve microstructure and reduce defects [4]. Since the microstructure and properties of printed parts vary widely depending on the process and alloy used, there is no definitive single pathway for controlling them [5]. Ongoing efforts include developing a comprehensive knowledge base for understanding microstructural features and how they are related to multiple properties for a wide variety of engineering alloys. Common steels and alloys of nickel, titanium, aluminium, and copper are not designed to withstand rapid cooling, repeated thermal cycles, large temperature gradients, and fluctuating stresses during AM.…”
Section: Introductionmentioning
confidence: 99%
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