Control of Ni–Sn interfacial reactions through reactant design

Kim, S.; Johnson, David C.

doi:10.1016/j.jallcom.2004.09.030

Cited by 12 publications

(7 citation statements)

References 24 publications

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“…However, amorphous phases have been prepared by mechanical alloying [43] and vapor quenching methods. [44,45] Tianen and Schwarz [43] prepared single-phase amorphous alloy at 25 at. pct Sn, through the mechanical alloying of Ni and Sn powders at 240 K. Geny et al [44] prepared amorphous Ni 1-x Sn x 0.57 £ x £ 0.73 thin films through the codeposition of elemental vapors on substrates at 77 K. Amorphous phases at Ni 3 Sn 0:89 and Ni 3 Sn 1:94 compositions have also been prepared through the electron-beam evaporation of pure elements on silicon substrate with a spincoated film of polymethylmethacralate.…”

Section: A Crystal Chemistrymentioning

confidence: 99%

“…pct Sn, through the mechanical alloying of Ni and Sn powders at 240 K. Geny et al [44] prepared amorphous Ni 1-x Sn x 0.57 £ x £ 0.73 thin films through the codeposition of elemental vapors on substrates at 77 K. Amorphous phases at Ni 3 Sn 0:89 and Ni 3 Sn 1:94 compositions have also been prepared through the electron-beam evaporation of pure elements on silicon substrate with a spincoated film of polymethylmethacralate. [45] Of course, the noncrystalline structures are not considered in our first-principles calculations.…”

Section: A Crystal Chemistrymentioning

confidence: 99%

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First-Principles Calculation of Phase Stability and Cohesive Properties of Ni-Sn Intermetallics

Ghosh

2008

Metall Mater Trans A

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The cohesive properties of Ni-Sn intermetallics (stable, metastable, and virtual), hitherto unexplored by density-functional theory (DFT) methods, are reported. Specifically, the total energies and cohesive properties of Ni, Sn, and 27 Ni-Sn intermetallics are calculated from firstprinciples, using ultrasoft pseudopotentials (USPP) and both local-density approximation (LDA) and generalized-gradient approximation (GGA) for the exchange-correlation functional. Among the intermetallics considered, the ground-state structures are consistent with experimental observations; however, not all of them are registered in the equilibrium-phase diagram. An important result of this systematic study, using both USPP-LDA and USPP-GGA, is that oC20-NiSn 4 is predicted to be the ground-state structure. Only recently, this phase has been observed as a product of the interfacial reaction in Ni/Sn diffusion couples. In addition, we find that the thermodynamic stability of a tetragonal phase, tP10-NiSn4, is very similar to that of oC20-NiSn 4 . The elastic stability of both tP10-NiSn 4 and oC20-NiSn 4 is confirmed by calculating their single-crystal elastic constants. The calorimetric data for the enthalpy of formation of stable intermetallics show an agreement that is better for those calculated with USPP-LDA than those calculated with USPP-GGA. In general, the experimental lattice parameters of stable and metastable phases are found to lie between those calculated using USPP-LDA and those calculated using USPP-GGA; however, in several cases, the values calculated using USPP-GGA agree to within 1 pct of the experimental data. The Ni 3 Sn 2 (ht) Ð Ni 3 Sn 2 (lt) transformation is discussed in terms of supergroup-subgroup relations. The bonding between the Ni and the Sn is discussed based on the analyses of the density of states (DOS) and the charge densities.

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Section: A Crystal Chemistrymentioning

confidence: 99%

Section: A Crystal Chemistrymentioning

confidence: 99%

First-Principles Calculation of Phase Stability and Cohesive Properties of Ni-Sn Intermetallics

Ghosh

2008

Metall Mater Trans A

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“…3f; 13,14 however, the XRD patterns in Fig. 3e do not match the Ni 3 Sn 4 phase nor any known IMC phase.…”

Section: Resultsmentioning

confidence: 87%

Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering

Seo

Cho

Lee

et al. 2006

J. Electron. Mater.

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We chose Sn-2.8Ag-20In and Sn-10Bi-10In (numbers are in weight percentages unless specified otherwise) as Pb-free solder materials for intermediate-step soldering. We then investigated how the two solders reacted with the under bump metallurgy (UBM) of Au/Ni (Au: 1.5 mm and Ni: 3 mm) at 210°C, 220°C, 230°C, and 240°C for up to 4 min. All of the Au UBM was dissolved into the solder matrix as soon as the interfacial reaction started. The reaction formed Au(In,Sn) 2 in the case of SnAgIn, and it formed Au(Sn,In) 4 and Au(In,Sn) 2 in the case of SnBiIn. The formation mechanism of the intermetallic phases is explained thermodynamically. The exposed Ni layer reacted with the solder and formed Ni 28 Sn 55 In 17 in case of SnAgIn, and formed Ni 3 (Sn,In) 4 in case of SnBiIn, at the solder joint interface. Under the same soldering conditions, the Ni 3 (Sn,In) 4 layer in the SnBiIn/UBM is thicker than the Ni 28 Sn 55 In 17 layer in the SnAgIn/UBM. Because of the thicker intermetallic compound layer, the SnBiIn solder joint has weaker shear strength than the SnAgIn solder joint.

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“…6b). Sn/Ni couples describe the main reaction products [44,58] and the phases detected by SEM-EDS (Table 2) were analysed in terms of the Ni-Sn [59], Sb-Sn [31,32] and Ni-Sb-Sn phase diagrams [60,61]. The information on the Ni-Sb-Sn system were summarised in [61] and until now they are not yet completed.…”

Section: Wetting Behaviour Of Sn-sb / Ni Systemsmentioning

confidence: 99%

Wetting and interfacial reactions: Experimental study of the Sb-Sn-X (X = Cu, Ni) systems

Novaković

Delsante

Borzone

2018

J min metall B Metall

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Experimental studies of the Cu-Sb-Sn and Ni-Sb-Sn systems have been carried out by the wetting tests, followed by the analysis of the microstructural evolution occurring at the interface between the liquid alloy and solid substrate. The wetting experiments on the Sb 30 Sn 70 / (Cu, Ni) and Sb 38.4 Sn 61.6 / (Cu, Ni) systems have been performed by using a sessile drop apparatus. The wetting behaviour of the two alloys in contact with Cu-substrate differs from that observed in the case of Ni-substrate. The Sb-Sn alloy / substrate interface was characterised by SEM-EDS analyses. For each system, the solidliquid interactions and the phases formed at the interface were studied with the help of the corresponding phase diagrams.

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Control of Ni–Sn interfacial reactions through reactant design

Cited by 12 publications

References 24 publications

First-Principles Calculation of Phase Stability and Cohesive Properties of Ni-Sn Intermetallics

First-Principles Calculation of Phase Stability and Cohesive Properties of Ni-Sn Intermetallics

Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering

Wetting and interfacial reactions: Experimental study of the Sb-Sn-X (X = Cu, Ni) systems

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