2013
DOI: 10.1002/lpor.201300093
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Control of surface charge for high‐fidelity nanostructuring of materials

Abstract: The universal problem of surface charging during focused ion milling has been fully resolved using a flood‐gun approach based on simultaneous co‐illumination with a UV light‐emitting diode (LED). Non‐distorted as‐designed nano‐patterns were milled using Ga+ ions on dielectric materials which charge up strongly. Deep‐UV (250–280 nm) LED co‐illumination during the ion beam milling fully discharges optically the surface under standard Ga+ ion‐milling conditions. Photo‐ionization of electrons trapped at the sub‐su… Show more

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Cited by 18 publications
(10 citation statements)
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“…A novel approach to control surface charging in SEM via the photoelectric effect was proposed and demonstrated recently [8]. The technique was used previously to eliminate surface charging in high-precision FIB fabrication [115] and uses deep-UV coillumination during SEM imaging. Photons of the deep-UV light (~260 nm wavelength) have sufficient energy to liberate electrons from the sample surface reducing strong charge gradients.…”
Section: Surface Charge Removal By Deep-uv Illuminationmentioning
confidence: 99%
“…A novel approach to control surface charging in SEM via the photoelectric effect was proposed and demonstrated recently [8]. The technique was used previously to eliminate surface charging in high-precision FIB fabrication [115] and uses deep-UV coillumination during SEM imaging. Photons of the deep-UV light (~260 nm wavelength) have sufficient energy to liberate electrons from the sample surface reducing strong charge gradients.…”
Section: Surface Charge Removal By Deep-uv Illuminationmentioning
confidence: 99%
“…The 260 nm wavelength LED light has slightly lower photon energy than the work function of titania: 4.9 eV or equivalent to a 250 nm wavelength. However, electrons from any surface defects are efficiently excited at 260 nm as it was demonstrated in the case of Ga + -ion milling under DUV illumination 18 . SEM imaging has been tested under DUV co-illumination which is strongly absorbed at the surface.…”
Section: Resultsmentioning
confidence: 92%
“…Here we demonstrated the unique merit of FIB beam milling due to long depth-of-focus by patterning on a 3D surface of an axicon. Fast and accurate FIB milling becomes feasible at high fabrication throughput by mitigation of surface charging [34]. Combination of the direct laser and ion-beam writing methods is promising for novel applications in 3D micro-and nano-photonics [35].…”
Section: Resultsmentioning
confidence: 99%