Control Strategy for Improved After-Etch Overlay at Wafer Edge of DRAM Layers in High-Volume Manufacturing

Chang, Jimmy; Huang, Chu‐Yu; Zhang, Wei; Sun, Helei; Zhou, Xiaofang; Wang, Bing; Fan, Heng; Jiang, Hao; Jiang, Justin; Reeuwijk, Matthijs van; Vidojkovic, Maja; Li, Hua

doi:10.1109/iwaps57146.2022.9972326

2022 International Workshop on Advanced Patterning Solutions (IWAPS) 2022

DOI: 10.1109/iwaps57146.2022.9972326

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Control Strategy for Improved After-Etch Overlay at Wafer Edge of DRAM Layers in High-Volume Manufacturing

Jimmy Chang¹,

Chu‐Yu Huang²,

Wei Zhang³

et al.

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Control Strategy for Improved After-Etch Overlay at Wafer Edge of DRAM Layers in High-Volume Manufacturing

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