Controllable Crystallographic Texture in Copper Foils Exhibiting Enhanced Mechanical and Electrical Properties by Pulse Reverse Electrodeposition

Abstract

The texture evolution in copper foils prepared by a rapid pulse reverse electrodeposition (PRED) technique using an 'additive-free' electrolyte and the subsequent correlation with the mechanical and electrical properties is investigated in the present study. Control over (111), (100) and (101) crystallographic textures in copper foils has been achieved by optimization of the pulse parameters and current density. Hardness as high as 2.0-2.7 GPa, while maintaining the electrical conductivity in the same range as that of bulk copper was exhibited by these foils. The complete study of controlling the (111), (100) and (101) textures, CSL Σ3 coherent twin boundaries, grain refinement and their effect on the mechanical and electrical properties is performed in detail by characterizing the foils with electron backscatter diffraction (EBSD), X-ray diffraction (XRD), nanoindentation and electrical resistivity measurements. PRED technique with short and high energy pulses enabled the (111) texture while increasing the forward off-time with optimized current density resulted in the formation of (100) and (101) textures. The reverse/anodic pulse applied after every forward pulse aided the minimization of residual stresses with no additives in the electrolyte, stability of texture in the foils, grain refinement and formation of growth-twins.Among the three highly textured copper foils, those with dominant (111) texture exhibited a lower electrical resistivity of ~1.65×10 -6 Ω-cm and better mechanical strength compared to those with (100) and (101) textures.

Controlling electrochemical growth of metallic zinc electrodes: Toward affordable rechargeable energy storage systems

“…A few studies report on the crystallographic orientation of Zn deposits obtained with pulsed protocol (192,193). The correlation is, however, not straightforward, unlike what has been shown for Cu deposition-Strong (111), (100), and (101) textures can be achieved respectively by optimization of the pulse parameter (194). In light of the greater crystal anisotropy of Zn than Cu, we speculate that similar quality of texturing can be realized in Zn systems, which warrants further explorations.…”

The Effect of Interface Morphology on the Electro-Mechanical Properties of Ti/Cu Clad Composites Produced by Explosive Welding

“…[61] Typically, the <111> components exhibit the lowest electrical resistivity for fcc metals and alloys. The effect of the <111> and <100> fiber-type texture formation on the electrical resistivity of copper wires has been discussed by Pavithra et al [62] and Moisy [47] and they found no significant effect. On the other hand, Ueda et al [60] showed that the electrical resistivity of cold-rolled cp-Ti is dependent on the formation of specific texture components.…”

Controllable Pulse Reverse Electrodeposition of Mesoporous LixMnO2 Nano/Microstructures with Enhanced Electrochemical Performance for Li-Ion Storage

“…Although varying pulse reverse parameters leads to the notable evolution of plane orientation and crystal structure of all LMO-R samples, the most significant structural changes happen in the case of 79.17%LMO-R having higher crystallinity compared to the other samples. Apparently, the lowest value of f ′ applied to the electrodeposition of 79.17%LMO-R provides sufficient time to form more ordered plane orientation as a result of sluggish pulse alternation. , Basically, the meticulous adjusting of pulse reverse parameters (either lower values of f ′ or higher values of t c up to some extents) not only provokes the incorporation of Li + into MnO 2 lattice, but also can evidently affect the crystal structure evolution of Li x MnO 2 .…”