Controlled Fracture‐Based Micropatterning of Ruddlesden–Popper Halide Perovskite for Ultra High‐Density Arrays of Micro Light Emitting Diodes

Abstract

Quasi‐2D Ruddlesden–Popper perovskite (RPP) have surfaced as a promising candidate for light emitting diodes (LEDs) due to its outstanding optoelectronic properties. However, a reliable approach for patterning RPPs remains elusive due to the use of polar solvents in lithographic processes, which can damage the RPP. Here, a reliable and damage‐free dry micropatterning method of RPPs is reported, which also offers a cost/time advantage compared to conventional patterning methods. The sharp edges of high aspect ratio silicon micropillars are used to cut RPPs to a pre‐defined shape and then the cut RPPs are delaminated to obtain a patterned array of RPPs. The resultant patterned array exhibits no sign of degradation or discernable difference between adjacent pixels, achieving a ≈100% yield. The obtained array is utilized to fabricate a pixelated LED where a sharp electroluminescence (EL) spectrum peaking at 410 nm with full‐width‐at‐half‐maximum (FWHM) of 10 nm is observed. The pixelated devices demonstrate the potential to suppress EQE drops as the pixel size decreases, attributed to both the damage‐free micropatterning process and the defect tolerance of RPPs. Moreover, further improvements of the patterning method are demonstrated to avoid parasitic emission and suggest a promising strategy to fabricate pixel‐accessible micro‐LEDs.