“…However, PS limit is represented by the inability to finely control film structure at the atomic scale, which often results in undesired material properties and failure of the coating [9,10]. Alternatively, in order to finely control film structure, morphology and stoichiometry, a variety of physical-(PVD) and chemical-(CVD) vapour deposition techniques is available for W coatings deposition [11,12,13,14]. Pulsed Laser Deposition (PLD) is one of the most versatile PVD techniques, by which both mono-or multi-elemental films such as metals, compounds and carbon based materials, also replicating complicated or unusual target stoichiometry can be deposited [15,16,17,18,19,20,21].…”