2022
DOI: 10.1021/acsapm.2c01415
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Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages

Abstract: Temporary bonding and debonding (TBDB) is a key technology in the semiconductor field to enable 2.5D/3D integration of devices. However, the conventional polyimides, which serve as the laser-response material in TBDB, exhibit extremely poor solubility in aprotic polar solvents due to high-temperature imidization, limiting the cleaning process for wafers after debonding. Herein, a feasible method of controlling the curing temperature to enhance the solubility of thermoplastic polyimide (TPI) has been developed.… Show more

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Cited by 14 publications
(3 citation statements)
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References 50 publications
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“…In Figure 3B, there is a broad absorption peak at 2θ of 10 -30 in pure PI, which represents the amorphous structure of the PI matrix. 43 In addition, only the diffraction peaks of BaTiO 3 are found in all of the composite films, corresponding to the fact that the outermost PDA layer overlays the inner MgO layer.…”
Section: Resultsmentioning
confidence: 98%
“…In Figure 3B, there is a broad absorption peak at 2θ of 10 -30 in pure PI, which represents the amorphous structure of the PI matrix. 43 In addition, only the diffraction peaks of BaTiO 3 are found in all of the composite films, corresponding to the fact that the outermost PDA layer overlays the inner MgO layer.…”
Section: Resultsmentioning
confidence: 98%
“…105,106 When asymmetric biphenyl-tetracarboxylic acid dianhydride was introduced into the molecular structure of TPI, the packing density and interaction force between molecular chains decreased. 107,108 TPI with increased molecular chain mobility can diffuse thoroughly on the PI lm, and the adhesion between the two is good. TPI can effectively inltrate the copper surface and wrap small copper nodules; carbon compounds can be found on the surface of stripped copper foil.…”
Section: Surface Treatment and Modication Of Pi Lmsmentioning
confidence: 99%
“…Adhesives play an important role and are widely used in industries, such as aerospace, automobile manufacturing, civil engineering, and daily life . In recent years, recycling valuable adherends from waste products by debonding has attracted significant attention from not only the academia but also business circles for its fresh perspective of green chemistry and sustainability. For traditional adhesives, they are chemically stable and usually have a strong interaction (covalent bonds, physical interactions, or their combinations) with the substrate surfaces. Therefore, debonding of the adhesive joints can only be conducted by thermal degradation, cutting, etc., which may inevitably lead to damage or even destroy the substrates.…”
Section: Introductionmentioning
confidence: 99%