A low-temperature CO2-based technology, supercritical fluid immersion deposition (SFID),
has been developed for producing Pd, Cu, Ag, or other metal films on Si-based substrates in
supercritical CO2 solutions. The reaction is most likely initiated by oxidation of elemental
silicon to SiF4 or H2SiF6 with HF, causing the reduction of a metal chelate precursor to the
metallic form on silicon surface in CO2. Using this method, only the substrate surfaces
exposed to CO2 solutions are coated with metals, and the metal films (Pd, Cu, and Ag) exhibit
good coverage, smooth and dense texture, and high purity. Preliminary experiment indicates
that palladium films deposited on silicon by SFID can be converted to palladium silicide by
annealing treatment. Metal films can also be deposited onto germanium substrates using
SFID. The gaslike properties and high pressure of the supercritical fluids, combined with
the low reaction temperature, make this SFID method potentially useful for fabricating thin
films of metal or metal silicide in small features, which is difficult to accomplish by
conventional metal deposition methods.