2024
DOI: 10.1177/09544089241234499
|View full text |Cite
|
Sign up to set email alerts
|

Controlling recast layer and material removal in reverse µEDM for sustainable fabrication of microelectrode arrays

Suresh Pratap,
Somak Datta,
Vinay Sharma

Abstract: Microelectrode arrays (MEAs) are essential for researching neurons and heart tissue because they record and stimulate neuronal activity. For manufacturing MEAs on conductive materials, reverse microelectrical discharge machining, or reverse µEDM, presents a viable method. However, achieving precise MEAs requires control over recast layers generated during micromachining. This study focuses on recast layer thickness (RLT) and material removal rate (MRR) as key performance indicators for sustainable reverse µEDM… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2024
2024
2024
2024

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 1 publication
(1 citation statement)
references
References 34 publications
0
1
0
Order By: Relevance
“…In other words, in contrast to traditional machining techniques, the micro EDM technique demonstrates a concurrent trade-off between machining efficiency and accuracy: the geometric accuracy of the microholes improves as the machining time decreases. Researchers have developed auxiliary processing techniques to remove interelectrode debris, such as the vibration and rotation of electrodes [14][15][16], which have shown some improvement, but still cannot completely avoid the accumulation of discharge debris in the interelectrode gap [17,18].…”
Section: Introductionmentioning
confidence: 99%
“…In other words, in contrast to traditional machining techniques, the micro EDM technique demonstrates a concurrent trade-off between machining efficiency and accuracy: the geometric accuracy of the microholes improves as the machining time decreases. Researchers have developed auxiliary processing techniques to remove interelectrode debris, such as the vibration and rotation of electrodes [14][15][16], which have shown some improvement, but still cannot completely avoid the accumulation of discharge debris in the interelectrode gap [17,18].…”
Section: Introductionmentioning
confidence: 99%