“…A variety of devices have been reported using NP assembly techniques including novel optoelectronic devices (e.g., light-emitting diodes, sensors, solar cells, photodetectors, and transistors), optical and plasmon sensing devices, electrodes in nanoscale electrochemistry, printable chips, nano-pore biosensors, and transparent electrodes (Grzelczak et al 2010;Yang et al 2016;Flauraud et al 2017;Gwo et al 2016;Huang et al 2016;Su et al 2014;Lewis and Ahn 2015;Choi et al 2016;Xie et al 2015;Ellis et al 2014;Momotenko et al 2016;Blasco et al 2016). In response to the growing demand in the field, diverse techniques have been developed for 3D self-assembly of ligand-protected colloidal NPs including lithographic patterning, template-based methods, DNA-mediated assembly, dip-pen processes, and capillary assembly (Su et al 2014;Xie et al 2015), and also for 2D surface patterning such as etching of close-packed structures and atomic layer deposition (ALD) (Wang et al 2018;Dendooven et al 2017;Schmudde et al 2016;Hou et al 2018). In 3D printing technology, NPs are now widely used for 3D printing in ink-jet printers that are compatible with printing polymer and metals using colloidal inks (Hirt et al 2017).…”