Convective Cooling Evaluation of Electronic Devices using Lock-in Thermography

Świątczak, T.; Więcek, B.; Tomalczyk, K.

doi:10.1109/mixdes.2007.4286185

Cited by 1 publication

(2 citation statements)

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“…The thermal resistance between particular cells of the whole investigated substrate depends on the board thickness t, cells dimensions and thermal conductivity coefficient. Thermal capacitance depends on board dimensions (bulk) and aluminum oxide parameters (specific heat c w and density ρ) [3].…”

Section: Fig2 Chosen Node Of the Thermal Modelmentioning

confidence: 99%

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Frequency analysis of convective cooling for the multi heat-source electronic systems – modeling and IR measurements

Świątczak¹,

Więcek²,

Mey³

2010

Proceedings of the 2010 International Conference on Quantitative InfraRed Thermography

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In this article the authors focus on the research of the heat dissipation problem in electronic devices. For this purpose, a series of the numerical simulations were performed, a RC model of the electronic system with two heat sources was the object of the research. To confirm the results of the simulations, thermographic measurements were carried out. During the simulations, electronic system cooling conditions were changed as a result of varying model parameters. In the laboratory, cooling conditions of electronic system were dependent on the airflow speed around it. What is more, both simulations and measurements were performed for different positions and distances between heat sources. The authors estimated cooling conditions of the electronic system with two heat sources, with a particular interest set to the position and the distance between the heat sources. In this work the authors demonstrate, that a distribution of the heat sources in the investigated electronic system improves cooling conditions.

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Section: Fig2 Chosen Node Of the Thermal Modelmentioning

confidence: 99%

“…The dependence between convection coefficient and airflow speed was calculated too. For natural and forced convection results of the Spice simulation were obtained [3]. Calculated values of the resistance for particular convection coefficients and their equivalents of airflow speed are shown in table 1.…”

Section: Simulationsmentioning

confidence: 99%