Convergence and Validation in ParaPower: A Design Tool for Phase Change Materials in Electronics Packaging

Deckard, Michael; Shamberger, Patrick J.; Fish, Michael; Berman, Morris; Wang, Justin; Boteler, Lauren

doi:10.1109/itherm.2019.8757334

Cited by 16 publications

(2 citation statements)

References 15 publications

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“…When it comes to 2.5D and 3D layouts, geometry complexity poses a challenge to traditional substrate metallisation processes, whereas 3D SLM metallisation technology [89] will make it possible for the rapid design and prototype verification of power modules. Another example is the use of ParaPower, a fast thermal model analysis tool for aiding power electronic package configuration [93]. By using ParaPower to find the optimal heat sink construction, and then manufacturing the heat sink with complex structures, a more appropriate thermal management solution can be achieved.…”

Section: Thermal Management and Packagingmentioning

confidence: 99%

Applications and Future of Automated and Additive Manufacturing for Power Electronics Components and Converters

Zhang

Yuan

2022

IEEE J. Emerg. Sel. Topics Power Electron.

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Additive manufacturing techniques have by far been utilised to make 3D passive components (i.e. resistors, inductors, and capacitors), circuit boards and packages of power electronic devices. This paper provides an overview of automatic assembling technologies and additive manufacturing applications in power converters, as well as the advantages and limitations of each additive manufacturing process in this area. It shows that direct metal laser sintering offers advantages for manufacturing inductors with the conductivity of 68% of the International Annealed Copper Standard (IACS) and magnetic cores with the permeability greater than 10000 at 50 Hz. The additive electronics from Nano Dimension show great promise for fabricating power converter PCBs with the conductivity from 25% to 50% IACS. Additive manufacturing in thermal management and packaging has been extensively studied and will spark more changes in these fields. Besides, the potential of the combination of automated and additive manufacturing in power electronic systems has also been discussed, which sets the basis for future development of advanced manufacturing of power electronics.

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Section: Thermal Management and Packagingmentioning

confidence: 99%

Applications and Future of Automated and Additive Manufacturing for Power Electronics Components and Converters

Zhang

Yuan

2022

IEEE J. Emerg. Sel. Topics Power Electron.

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“…For computational efficiency, thermal analysis is performed using ParaPower, a Matlab-based simulation package developed at the Army Research Lab. Detailed information about ParaPower can be found in [28,29], so we only briefly describe it here. ParaPower utilizes a resistance network modeling scheme, in which the simulation space is discretized into volumetric elements.…”

Section: Computational Model In Parapowermentioning

confidence: 99%

Machine-Learning Assisted Optimization Strategies for Phase Change Materials Embedded within Electronic Packages

Bhatasana,

Marconnet

2021

Preprint

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Leveraging the latent heat of phase change materials (PCMs) can reduce the peak temperatures and transient variations in temperature in electronic devices. But as the power levels increase, the thermal conduction pathway from the heat source to the heat sink limits the effectiveness of these systems. In this work, we evaluate embedding the PCM within the silicon device layer of an electronic device to minimize the thermal resistance between the source and the PCM to minimize this thermal resistance and enhance the thermal performance of the device. The geometry and material properties of the embedded PCM regions are optimized using a combination of parametric and machine learning algorithms. For a fixed geometry, considering commercially available materials, Solder 174 significantly outperforms other organic and metallic PCMs. Also with a fixed geometry, the optimal melting points to minimize the peak temperature is higher than the optimal melting point to minimize the amplitude of the transient temperature oscillation, and both optima increase with increasing heater power. Extending beyond conventional optimization strategies, genetic algorithms and particle swarm optimization with and without neural network surrogate models are used to enable optimization of many geometric and material properties. For the test case evaluated, the optimized geometries and properties are similar between all ML-assisted algorithms, but the computational time depends on the technique. Ultimately, the optimized design with embedded phase change materials reduces the maximum temperature rise by 19% and the fluctuations by up to 88% compared to devices without PCM.

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Transient thermal performance using phase change material integrated topology optimized heat sinks

Iradukunda

Vargas

Huitink

et al. 2020

Applied Thermal Engineering

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Convergence and Validation in ParaPower: A Design Tool for Phase Change Materials in Electronics Packaging

Cited by 16 publications

References 15 publications

Applications and Future of Automated and Additive Manufacturing for Power Electronics Components and Converters

Applications and Future of Automated and Additive Manufacturing for Power Electronics Components and Converters

Machine-Learning Assisted Optimization Strategies for Phase Change Materials Embedded within Electronic Packages

Transient thermal performance using phase change material integrated topology optimized heat sinks

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