Converting to lead-free solders: An automotive industry perspective

Winterbottom, W. L.

doi:10.1007/bf03222375

Cited by 68 publications

(31 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Binary alloys investigated include Sn-Ag, Sn-Au, Sn-Zn, Sn-Cd, Sn-Sb, and many others. [1][2][3][4][5][6][7][8] Ternary alloys of Sn-AgZn, 9 Sn-Zn-In, 10,11 Sn-Ag-Sb, 12 Bi-Sb-Sn, 13 Sn-BiAg, 14 Sn-Ag-Cu, 15 and Sn-Zn-Al 16 have been reported. Among these, Sn-Ag-Cu is one of the most frequently mentioned potential candidate systems for Pb-free solder.…”

Section: Introductionmentioning

confidence: 99%

Wetting interaction between Sn-Zn-Ag solders and Cu

Lin

Shih

2003

Journal of Elec Materi

View full text Add to dashboard Cite

The wetting interaction of Sn-(7.1-9)Zn-(0-3)Ag solders with Cu was investigated from 230°C to 300°C. The wetting time, wetting forces, and activation energy of the wetting reaction were studied. The wetting time decreases with increasing temperature and increases with Ag content. The wetting force exhibits a disproportional correlation to temperature rise, while no trend was observed with respect to Ag content. The wetting behavior was ascribed to the interaction between Cu and Zn. The AgZn 3 compound was formed at the interface when the solder contains 0.3% Ag and above, while it was formed within the bulk solder at 2% Ag and above.

show abstract

Section: Introductionmentioning

confidence: 99%

Wetting interaction between Sn-Zn-Ag solders and Cu

Lin

Shih

2003

Journal of Elec Materi

View full text Add to dashboard Cite

show abstract

“…[1][2][3] Among all the potential lead-free solders, eutectic Sn-3.5Ag solder has been broadly targeted as the foremost candidate to replace lead-bearing solders. [4][5][6][7] As are required for Pb-bearing solders, high reliability and good mechanical performance are also required for lead-free solders, especially solder joints, because during normal service conditions, the low melting solder alloys are subjected to creep and fatigue deformation. 8 Even at ambient temperature of operation, the homologous temperature for these alloys is high, around 0.6, while the interconnect temperatures can reach as high as 80∞C due to local heating.…”

Section: Introductionmentioning

confidence: 99%

Creep properties of eutectic Sn-3.5Ag solder joints reinforced with mechanically incorporated Ni particles

Guo

Lee

Lucas

et al. 2001

J. Electron. Mater.

View full text Add to dashboard Cite

The creep deformation behavior of eutectic Sn-3.5Ag based Ni particle reinforced composite solder joints was investigated. The Ni particle reinforced composite solder was prepared by mechanically dispersing 15 vol.% of Ni particles into eutectic Sn-3.5Ag solder paste. Static-loading creep tests were carried out on solder joint specimens at 25∞C, 65∞C, and 105∞C, representing homologous temperatures ranging from 0.6 to 0.78. A novel-design, miniature creep-testing frame was utilized in this study. Various creep parameters such as the global and localized creep strain, steady-state creep rate, onset of tertiary creep, and the activation energy for creep were quantified by mapping the distorted laser ablation pattern imprinted on the solder joint prior to testing. The Ni-reinforced composite solder joint showed improved creep resistance compared to the results previously reported for eutectic Sn-3.5Ag solder, Sn-4.0Ag-0.5Cu solder alloys, and for eutectic Sn-3.5Ag solder reinforced with Cu or Ag particle reinforcements. The activation energy for creep was ~0.52 eV for Sn-3.5Ag and Sn-4Ag-0.5Cu solder alloys. The activation energies ranged from 0.55-0.64 eV for Cu, Ag, and Ni reinforced composite solder joints, respectively. Most often, creep fracture occurred closer to one side of the solder joint within the solder matrix.

show abstract

“…In fact, the computer simulation studies showed that it is more realistic to take the localized strain approach over the uniform strain approach to predict the solder joint failure. 16 Thus, the fracture mechanics principles involving the crack initiation/propagation was suggested to forecast joint life than the homogenous strain route based on global displacements. The results of the initial interrupted shear tests from current joints can be found in Ref.…”

Section: Discussionmentioning

confidence: 99%