Conveyorised Horizontal System for PTH Using a Conductive Palladium Compound Direct Plate Process

A Kinetic Study of Direct Copper Plating via Pd Catalyst and S Ligand

“…A common concept [9][10][11] about the role of this PdS compound or other similar promotion steps is that the newly generated compound can form a highly conductive film so that the subsequent copper plating can be carried out. The logic basically follows the conductive polymer system.…”

Formation of PdS Compounds in Direct Metallization via Pd/Sn Catalyst Activation

“…A logical explanation for this process is that the immersion of sulfide solution would produce a palladium sulfide layer which can increase the surface conductivity to a level so that electroplating is feasible. 5 However, Yang et al 6 have already pointed out that (i) there is no noticeable increase in conductivity after the sulfide dip, (ii) the reason that the surface becomes electrolytically platable after the sulfide dip can be explained in terms of a dual-reaction model via bridging ligand concept. Yet the identification of surface compound after sulfide dip remains unresolved.…”