Cooling chip on PCB by embedded active microchannel heat sink

Peng, Yun-Hao; Wang, Dai-Hua; Li, Xinyu; Zhang, Ying

doi:10.1016/j.ijheatmasstransfer.2022.123251

Cited by 18 publications

(3 citation statements)

References 36 publications

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“…Where ks represents the thermal conductivity of the solid wall, Asf represents the actual heat transfer surface area, and m * represents the mass flow rate of the mini-channel flowing through. The fin efficiency is represented in equation ( 16), which is defined as equation (18). For the fin efficiency of a uniform cross-section straight fin, the expression is:…”

Section: Flow and Thermal Modelmentioning

confidence: 99%

“…Researchers have proposed a variety of active cooling methods and passive cooling methods to dissipate heat generated by electrical devices [15,16]. While active cooling technology makes use of coolants and all kinds of enhanced heat transfer techniques, passive cooling technology is focused on improving the performance of the materials of the heat sink [17][18][19][20]. Among active cooling methods, air cooling is a traditional solution scheme suitable for scenarios with a heat flux below 10 W/m 2 [21,22].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Flow and Heat Transfer Performance of Liquid Metal in Mini-Channel and Verification of Geometric Parameter Optimization

Xiang,

Yang,

Wang

et al. 2023

J. Adv. Therm. Sci. Res.

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With the rapid development of the electronics industry, the power of devices continues to rise, and seeking more efficient cooling technologies has become a key challenge in various applied scenarios. This study contributes to a novel and efficient heat dissipation method for chips employing liquid metal as a coolant. In this paper, the flow and heat transfer performance of a novel liquid metal (Ga61In25Sn13Zn1) in a mini-channel heat sink is conducted. Using pressure difference, pump power, and total thermal resistance as object parameters, a comprehensive optimization about Hp (channel height), Wc (channel width), Ww (wall thickness), and tb (base thickness) is presented. The optimized parameter combination is Hp = 7 mm, Wc = 0.6 mm, Ww = 0.4 mm, and tb = 0.2 mm. Furthermore, all of the optimization parameters are verified through the design method of orthogonal experiments.

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Section: Flow and Thermal Modelmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Flow and Heat Transfer Performance of Liquid Metal in Mini-Channel and Verification of Geometric Parameter Optimization

Xiang,

Yang,

Wang

et al. 2023

J. Adv. Therm. Sci. Res.

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“…The microfluidic system holds immense potential for a wide range of applications, including drug delivery [1][2][3], biochemical applications [4][5][6][7][8], robotics [9,10], micro-electronics cooling [11][12][13], and more. As the core of this system, micropump plays a crucial role in its overall functionality.…”

Section: Introductionmentioning

confidence: 99%

Dual Synthetic Jets Actuator and Its Applications Part V: Novel Valveless Continuous Micropump Based on Dual Synthetic Jets with a Tesla Structure

et al. 2023

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The valveless micropump based on dual synthetic jets is a potential fluid pumping device that has the ability to transport fluid continuously. In order to improve the performance of this device, a novel valveless continuous micropump based on dual synthetic jets with a Tesla structure was proposed by combining a double Tesla symmetrical nozzle and a dual synthetic jets actuator. The mechanism of the novel micropump and its flow field characteristics were analyzed, combined with numerical simulation and a PIV experiment. The performance of the novel micropump was compared with that of a dual synthetic jet micropump based on a traditional shrinking nozzle. The novel micropump achieved continuous flow with a larger and more stable flow rate in one cycle. The maximum pump flow speed reached 12 m/s. Compared with the traditional type, the pump flow rate was increased by 5.27% and the pump flow pulsation was reduced by 214.93%. The backflow and vortex inside the nozzle were prevented and inhibited effectively by the Tesla structure. The velocity and influence range of the pump flow increased with the intensification of driving voltage in a certain range.

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Liquid Cooling for High‐Heat‐Flux Electronic Devices

2024

Thermal Management for Opto‐electronics Packaging and Applications

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Cooling chip on PCB by embedded active microchannel heat sink

Cited by 18 publications

References 36 publications

Flow and Heat Transfer Performance of Liquid Metal in Mini-Channel and Verification of Geometric Parameter Optimization

Flow and Heat Transfer Performance of Liquid Metal in Mini-Channel and Verification of Geometric Parameter Optimization

Dual Synthetic Jets Actuator and Its Applications Part V: Novel Valveless Continuous Micropump Based on Dual Synthetic Jets with a Tesla Structure

Liquid Cooling for High‐Heat‐Flux Electronic Devices

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