2016
DOI: 10.1117/12.2228462
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Cooling of organic light-emitting diode display panels with heat pipes

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“…Thermal management could be divided into passive and active method. Heat pipe, fins, microencapsulating, phase change materials, heatconducting glue , heat spreaders like copper and graphite were the most popular passive thermal dissipation method [7][8][9] while air fan, micro-channel, micro-jet [10][11] as well as thermoelectric cooling were the active thermal technologies.…”
Section: Introductionmentioning
confidence: 99%
“…Thermal management could be divided into passive and active method. Heat pipe, fins, microencapsulating, phase change materials, heatconducting glue , heat spreaders like copper and graphite were the most popular passive thermal dissipation method [7][8][9] while air fan, micro-channel, micro-jet [10][11] as well as thermoelectric cooling were the active thermal technologies.…”
Section: Introductionmentioning
confidence: 99%