Cooling of power electronic devices using rectangular flat heat pipes with externally and internally cooled condenser regions

Rakshith, Bairi Levi; Asirvatham, Lazarus Godson; Angeline, Appadurai Anitha; Perinba Selvin Raj, Jaya Antony; Bose, Jefferson Raja; Joyce Beryl Princess, P.; Gautam, Sneha; Mahian, Omid; Ribatski, Gherhardt; Wongwises, Somchai

doi:10.1016/j.applthermaleng.2023.121474

Applied Thermal Engineering

2024

DOI: 10.1016/j.applthermaleng.2023.121474

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Cooling of power electronic devices using rectangular flat heat pipes with externally and internally cooled condenser regions

Bairi Levi Rakshith,

Lazarus Godson Asirvatham,

Appadurai Anitha Angeline

et al.

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Cited by 5 publications

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Cooling of power electronic devices using rectangular flat heat pipes with externally and internally cooled condenser regions

Cited by 5 publications

References 44 publications

Multi-objective optimization of thermal management system for multiple heat source arrays electronic chassis in a noiseless environment

Multi-objective optimization of thermal management system for multiple heat source arrays electronic chassis in a noiseless environment

Enhancing heat transfer characteristics and optimization of a multi-jet cooling system

Thermal management performance of a novel elliptically grooved flat heat pipe system embedded with internally cooled condenser

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