Developing a highly efficient multifunctional epoxy adhesive
is
still an enormous challenge, which can rapidly cure at room temperature
and has excellent low-temperature resistance performance and is crucial
for the epoxy adhesive and electrical sealing fields during severe
cold seasons. Herein, diglycidyl phthalate (DP) was synthesized with
phthalic anhydride (PA) and epichlorohydrin (ECH) to enhance the curing
rate and low-temperature resistance of bisphenol A diglycidyl ether
(DGEBA) adhesive. The modified DP/DGEBA adhesives were systematically
analyzed by gel time, mechanical properties, and aging resistance
(time, temperature, and dry/wet treatment). The results showed that
DP with highly active ester groups significantly accelerates the curing
speed of DP/DGEBA. DP’s rigid aromatic ring-benzene ring and
flexible group-ester group gave the adhesive better low-temperature
resistance. When the addition of DP was 10 wt % (based on the mass
of DGEBA), the gel time of DP/DGEBA epoxy adhesives was reduced by
58 min compared to unmodified DGEBA epoxy adhesive, and after aging
at low temperature (−20 °C) for 7 days, the tensile shear
strengths of polyvinyl chloride (PVC) and aluminum plate increased
by 76.2 and 80.6%, respectively. The results of non-isothermal curing
kinetics and dynamic mechanical analysis suggested that when the amount
of DP was 10 wt %, the reaction activation energy of DP/DGEBA epoxy
adhesive decreased by 4.0%, and the cross-linking density increased
by 8.9%. Moreover, the toughness of the modified adhesive was also
improved. This study opens up a feasible way for the development of
a low temperature-resistant epoxy adhesive cured rapidly at room temperature
in practical application.