1992
DOI: 10.1002/macp.1992.021930403
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Copolymerization of N‐chlorophenylmaleimides with vinyl acetate

Abstract: By radical copolymerization, thermostable copolymers of N-(2-chlorophenyl)maleimide (ZCPMI), N-(3-chlorophenyl)maleimide (3CPMI) and N-(4-chlorophenyl)maleimide (4CPMI) with vinyl acetate were prepared. The values of reactivity ratios determined according to the Kelen-Tud6s method are: r2CPMI = 0,148 and rvA = 0,049; r3CpMI = 0,221 and rvA = 0,032; r&-pM, = 0,655 and rvA = 0,O. The position of the C1 atom in the phenyl ring of CPMI influences the copolymerization kinetics. 2CPMI exhibits the strongest tendency… Show more

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Cited by 8 publications
(6 citation statements)
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“…N-(4-Chlorophenyl) maleimide was prepared by the reaction of maleic anhydride with 4-chloroaniline in acetone followed by dehydrocyclization of the resulting maleamic acid in the presence of acetic anhydride and sodium acetate. N-(4-Chlorophenyl) maleimide was recrystallized from ethanol (mp 114-115 • C [14]). Anhydrous sodium sulfide was prepared from nonahydrate sodium sulfide under vacuum in the presence of P 2 O 5 and gradually increasing the temperature to 105 • C.…”
Section: Methodsmentioning
confidence: 99%
“…N-(4-Chlorophenyl) maleimide was prepared by the reaction of maleic anhydride with 4-chloroaniline in acetone followed by dehydrocyclization of the resulting maleamic acid in the presence of acetic anhydride and sodium acetate. N-(4-Chlorophenyl) maleimide was recrystallized from ethanol (mp 114-115 • C [14]). Anhydrous sodium sulfide was prepared from nonahydrate sodium sulfide under vacuum in the presence of P 2 O 5 and gradually increasing the temperature to 105 • C.…”
Section: Methodsmentioning
confidence: 99%
“…The polymer compositions containing copolymers of halogen‐containing N ‐substituted maleimides were found to have flame retardant properties and high thermostability 122. 123 Thermosetting heat resistance bismaleimide‐containing resin compositions showing improved curability, adhesion, and processability, useful for printed circuit boards, contain alkylene or phenylene bismaleimides (63.3%), maleamic acid monoesters (27.2%), and unsaturated derivatives of maleic acid (9.5%). This monomer composition was mixed with glass filler, dicumyl peroxide and stearic acid, kneaded, transfer‐moulded at 175 °C, and postcured at 200 °C for 8 h to give a test piece showing of bending strength a 98 Mpa at 20 °C and 69.5 Mpa at 240 °C 124.…”
Section: Some Properties and Applicationsmentioning
confidence: 99%
“…During recent decades, the increasing requirements of high‐technology industries have been the driving force in the development of new synthetic and artificial polymer systems that combine thermal stability with specific functional properties. Copolymerization reactions involving N ‐phenylmaleimide ( N ‐PhMI) monomer have generated great interest because of the large number of possibilities that they offer in the preparation of new materials with improved properties, including flame and heat resistance as well as thermal and chemical stability 1–10. Maleimide polymers have good thermal stability with high glass transition temperatures due to their polar five‐membered imide ring structure,11 and interest in the synthesis of new types of these polymeric materials as well as the modification of the primary structure of the polymers continues to grow 12–14…”
Section: Introductionmentioning
confidence: 99%