Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications

Abstract

Porous carbon-carbon preforms, based on three-dimensional networks of PAN (Polyacrylonitrile)-based carbon fibers and various volume fractions of chemical vapor-deposited (CVD) carbon, were impregnated by oxygen-free, high-conductivity (OFHC) Cu, Cu-6Si-0.9Cr, and Cu-0.3Si-0.3Cr (wt pct) alloys by pressure infiltration casting. The obtained composites were characterized for their coefficient of thermal expansion (CTE) and thermal conductivity (K) along the through-thickness and two in-plane directions. One composite, with a 28 vol pct Cu-0.3Si-0.3Cr alloy, showed outstanding potential for thermal management applications in electronic applications. This composite exhibited approximately isotropic thermal expansion properties (CTE ϭ 4 to 6.5 ppm/K) and thermal conductivities (k ≥ 260 W/m K).

Mechanical and electrical properties of carbon‐nanotube‐reinforced Cu–Ti alloy matrix composites

“…On the other hand, it is well known that alloying of copper with a strong carbide‐forming element can promote wetting and bonding of carbon materials 21, 22. High bonding strength of carbon/copper composites is observed by using copper alloys with minor additions of Ti, Cr, and Zr 22–24. Therefore, it is very necessary to evaluate the effectiveness of a matrix‐alloying method for the interface modification of Cu/CNT composites.…”

Prediction and Measurement of Thermal Transport Across Interfaces Between Isotropic Solids and Graphitic Materials

“…Carbon nanotubes have been suspended in liquids to increase the overall effective thermal conductivity of the liquids [2,3], as well as grown in arrays to act as thermal interface materials (TIMs) [4][5][6][7]. In addition, graphite has been implemented to structurally reinforce metallic heat spreaders while simultaneously increasing effective thermal conductivity [8,9]. However, despite the fact that the intrinsic thermal conductivity of these allotropes can exceed several thousand W m À1 K À1 , their incorporation into existing abatement technologies does not always produce correspondingly impressive results.…”

Preparation of Cf/Cu–C contact strip and wear behaviour under electric current

“…Kitamura et al 11 mechanically mixed the short cut copper coated carbon fibre with copper and tin powders, then followed by hot pressing to prepare carbon fibres reinforced copper and tin composite materials. In addition, carbon/carbon fibre/copper composite materials and fibre reinforced C/Cu contact strip composite materials [12][13][14] were fabricated by the pressure infiltration method. Compared with pure carbon contact strip, the mechanical strength of these materials were improved, but these materials also suffered from unstable tensile property, insufficient arc resistant ability and metal shed phenomenon; 15 in addition, mechanical, conductivity and heat conducting properties were inferior due to the poor interfacial wettability of C/Cu phase, [16][17][18] which increase the abnormal wear of the friction pairs instead.…”